Bluetooth LE Profile API document
Bluetooth LE Profile API document Rev.1.00 [May 22, 2020]
st_ble_gap_bond_info_t Struct Reference

Bonding information used in R_BLE_GAP_SetBondInfo(). More...

Data Fields

st_ble_dev_addr_tp_addr
 Address of the device which exchanged the keys. More...
 
st_ble_gap_auth_info_tp_auth_info
 Information about the keys. More...
 
st_ble_gap_key_ex_param_tp_keys
 Keys distributed from the remote device in paring. More...
 

Detailed Description

Bonding information used in R_BLE_GAP_SetBondInfo().

Field Documentation

◆ p_addr

st_ble_dev_addr_t* st_ble_gap_bond_info_t::p_addr

Address of the device which exchanged the keys.

◆ p_auth_info

st_ble_gap_auth_info_t* st_ble_gap_bond_info_t::p_auth_info

Information about the keys.

◆ p_keys

st_ble_gap_key_ex_param_t* st_ble_gap_bond_info_t::p_keys

Keys distributed from the remote device in paring.