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Bluetooth LE Profile API document
Bluetooth LE Profile API document Rev.1.00 [May 22, 2020]
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Bonding information used in R_BLE_GAP_SetBondInfo(). More...
Data Fields | |
st_ble_dev_addr_t * | p_addr |
Address of the device which exchanged the keys. More... | |
st_ble_gap_auth_info_t * | p_auth_info |
Information about the keys. More... | |
st_ble_gap_key_ex_param_t * | p_keys |
Keys distributed from the remote device in paring. More... | |
Bonding information used in R_BLE_GAP_SetBondInfo().
st_ble_dev_addr_t* st_ble_gap_bond_info_t::p_addr |
Address of the device which exchanged the keys.
st_ble_gap_auth_info_t* st_ble_gap_bond_info_t::p_auth_info |
Information about the keys.
st_ble_gap_key_ex_param_t* st_ble_gap_bond_info_t::p_keys |
Keys distributed from the remote device in paring.