DICE (WAFER 0)

Title	Information
Package Description	DIE SALE (PRICE IN GOOD DIE), DIE SALE (PRICE IN GOOD DIE)-UNSAWN
Package Status	Active
Package Type	WAFER
Class	WAFER
Package Code	DICE
Category	G
Lead Count	0
Pb (Lead) Free	Yes
Length	0mm
Pb Free Category	e3 Sn
Width	0mm
Seated height or Package height (Please check the outline drawing)	0mm
Pitch	0mm
Package Carrier	Wafer
Pkg. Dimensions (mm)	0.0 x 0.0 x 0.0

Documentation


Type	Title	Date
Package Outline Drawing	Bumped Die Outline Drawing Package Code: DICE Package Code: DICE DICEW 1.503 x 2.555 x 0.375 mm Body, 0.150mm Pitch PDF 696 KB	Mar 1, 2022
Package Outline Drawing	Bumped Die Outline Drawing Package Code: DICE DICEW 1.503 x 2.555 x 0.375 mm Body, 0.150mm Pitch PDF 716 KB	Mar 1, 2022
End Of Life Notice	PDN# : U-10-16 PRODUCT DISCONTINUANCE NOTICE FOR SELECTIVE MC CLOCK DEVICES PDF 45 KB	Nov 16, 2010
3 items