Title Information
Package Name W8X8.64
Package Previous Code WDB
Package Description 8x8 Array 64 Balls, 0.5mm Pitch, Wafer Level Chip Scale Pkg, -Amkor,Taiwan
Package Status Active
Package Type WLCSP-TCURDL
Class PLASTIC
Package Code WDB
Category PLASTIC
Lead Count 64
Pb (Lead) Free Yes
Length 4.03mm
Width 4.03mm
Seated height or Package height
(Please check the outline drawing)		 0.6mm
Pitch 0.5mm
Pkg. Dimensions (mm) 4.03 x 4.03 x 0.60

Documentation
Type Title Date
Package Outline Drawing
Package Drawing WLCSP-TCURDL 64pin W8X8.64
PDF 160 KB
1 item