Title Information
Package Name W4X4.16B
Package Previous Code WFG
Package Description 4x4 ARRAY 16 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Package Status Active
Package Type WLCSP-TCURDL
Class PLASTIC
Package Code WFG
Category PLASTIC
Lead Count 16
Pb (Lead) Free Yes
Length 1.66mm
Width 1.66mm
Seated height or Package height
(Please check the outline drawing)
0.5mm
Pitch 0.4mm
Pkg. Dimensions (mm) 1.66 x 1.66 x 0.50

Documentation

Type Title Date
Package Outline Drawing PDF 93 KB
1 item