Title Information
Package Name W5X5.25H
Package Previous Code WPO
Package Description 25 Ball 5x5 Array UltraThin Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
Package Status Active
Package Type WLCSP-BP
Class PLASTIC
Package Code WPO
Category PLASTIC
Lead Count 25
Pb (Lead) Free Yes
Length 2.07mm
Width 2.07mm
Seated height or Package height
(Please check the outline drawing)		 0.28mm
Pitch 0.4mm
Pkg. Dimensions (mm) 2.07 x 2.07 x 0.28