Title Information
Package Name W6X6.36D
Package Previous Code WPZ
Package Description 6x6 36 balls, 0.4mm Pitch, WLCSP; ASE Chung-Li
Package Status Active
Package Type WLCSP-BP
Package Code WPZ
Category PLASTIC
Lead Count 36
Pb (Lead) Free Yes
Length 2.41mm
Width 2.41mm
Seated height or Package height
(Please check the outline drawing)		 0.5mm
Pitch 0.4mm
Pkg. Dimensions (mm) 2.41 x 2.41 x 0.50

Documentation
Type Title Date
Package Outline Drawing
W6x6.36D: 36 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
PDF 152 KB
1 item