Title Information
Package Name W5X7.35D
Package Previous Code WQQ
Package Description 5x7 35 Balls, 0.4mm Pitch, WLCSP - UAT
Package Status Active
Package Type WLCSP-TKCURDL
Package Code WQQ
Category PLASTIC
Lead Count 35
Pb (Lead) Free Yes
Length 3.4mm
Width 2.39mm
Seated height or Package height
(Please check the outline drawing)		 0.5mm
Pitch 0.4mm
Pkg. Dimensions (mm) 3.40 x 2.39 x 0.50

Documentation
Type Title Date
Package Outline Drawing
W5x7.35D: 35 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
PDF 150 KB
1 item