Pioneering Ultra-Low Power Wireless Solutions
Since its establishment in 2014, Tangshan Hongjia Electronic Technology Co., Ltd. has been at the forefront of developing ultra-low power modules for wireless communication. With a strong commitment to technological innovation, Hongjia specializes in System-in-Package (SIP) and PCBA solutions that integrate Bluetooth®, Wi-Fi®, and LPWAN technologies into ultra-compact modules. These products serve a wide range of applications, from smart homes and medical devices to industrial automation.
Hongjia’s journey with Renesas began in 2014 when the company adopted the DA14580 System-on-Chip (SoC) to develop the HJ-580 series of modules. "Shortly after the release of DA14580, we became one of the first users in China to integrate it into our designs," said Liu Jiahang, CEO of Hongjia. "Our HJ-580 series was recognized as a world-class ultra-compact module and remains a popular choice in the market today."
Compact, Powerful, and Reliable Connectivity
Building on this success, Hongjia continued to innovate with the introduction of the HJ-131IMH and HJ-531IMF Bluetooth® Low Energy (LE) modules in 2020, based on Renesas’ DA14531. At the same time, the company launched the HJ-DA16200 Wi-Fi module utilizing the DA16200 SoC. These chip-level SIP modules integrate the SoC, antenna, and circuit into an ultra-compact LGA package, measuring as small as 4x4x1mm. This integration enhances physical protection, reduces size, and ensures stable RF performance.
"Renesas' connectivity solutions provide the ideal foundation for our modules, offering ultra-low power consumption and a compact form factor," Liu Jiahang explained. "These advantages are crucial for our customers, who require high performance in extremely space-constrained applications, such as medical wearables and IoT devices."
Hongjia has now shipped over 15 million modules incorporating Renesas LE and Wi-Fi devices, further solidifying its reputation as a trusted supplier of wireless communication solutions.
Solve Challenges with Renesas’ Support
In a highly competitive market, Hongjia faced several challenges, including meeting stringent size requirements, ensuring stable RF performance, and optimizing power efficiency. Renesas' advanced LE and Wi-Fi chipsets provided the perfect solution to these challenges. The DA14531, for instance, is the world’s smallest and lowest power SoC qualified against Bluetooth Core 5.1, making it ideal for ultra-compact designs.
"Renesas' local technical support team has been instrumental in our success," said Liu Jiahang. "They provided invaluable assistance throughout the development process, from chipset selection to system optimization. Their proactive approach significantly reduced our development cycles and ensured high product reliability."
Looking ahead, Hongjia remains committed to continuous innovation in wireless communication. "We are dedicated to expanding our SIP module portfolio and leveraging Renesas' latest connectivity solutions to meet evolving market demands," Liu Jiahang affirmed. "By strengthening our partnership with Renesas, we aim to deliver even more differentiated and high-performance wireless solutions to our customers worldwide."
With a focus on technological advancement, customer-driven innovation, and strong industry partnerships, Hongjia and Renesas continue to shape the future of wireless connectivity.