Skip to main content

Overview

Description

The RMHE41A184AGBG is a 67, 108, 864-word by 18-bit and the RMHE41A364AGBG is a 33, 554, 432-word by 36-bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using DRAM memory cell. The Low Latency DRAM-III chip is a 1. 1Gb DRAM capable of a sustained throughput of approximately 57. 6 Gbps for burst length of 4 (approximately 51. 2 Gbps for applications implementing error correction), excluding refresh overhead and data bus turn-around With a bus speed of 800 MHz, a burst length of 4, and a tRC of 13. 75 ns, the Low Latency DRAM-III chip is capable of achieving this rate when accesses to at least 6 banks of memory are overlapped. These products are packaged in 180-pin FCBGA.

Features

  • 2 cycle 800MHz DDR Muxed Address
  • Optional data bus inversion to reduce SSO, SSN, maximum I/O current, and average I/O power
  • Training sequence for per-bit deskew
  • Selectable Refresh Mode: Auto or Overlapped Refresh
  • Programmable PVT-compensated output impedance
  • Programmable PVT-compensated on-die input termination
  • PLL for improved input jitter tolerance and wide output data valid window

Comparison

Applications

Documentation

Type Title Date
Datasheet PDF 632 KB
Application Note PDF 551 KB
Product Change Notice PDF 4.86 MB 日本語
Brochure PDF 1.79 MB
Product Change Notice PDF 3.74 MB 日本語
Other PDF 793 KB 日本語
Product Change Notice PDF 1.46 MB 日本語
7 items

Design & Development

Models

ECAD Models

Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on the CAD Model links in the Product Options table. If a symbol or model isn't available, it can be requested directly from SamacSys.

Diagram of ECAD Models

Product Options

Applied Filters: