Renesas has recently added BGA144-pin and BGA64-pin packages to the mainstream RA family of 32-bit microcontrollers featuring Arm® cores, specifically the RA4M3, RA6M4, and RA6M5 groups. As a result, mass production of a total of 34 new products has begun. This enables a wider range of applications to utilize these products, which are high-performance and have rich connectivity and security features, even for applications with restricted implementation areas.
The RA4M3, RA6M4, and RA6M5 groups have been well-received for their high performance, connectivity, and security features. These devices have been widely deployed in a variety of consumer, medical, and industrial fields, including robot vacuums, IoT gateways, display devices, medical analyzers, and industrial sewing machines, among others.
The market response has exceeded expectations, and we have received many requests to adopt our products in equipment with space constraints that cannot accommodate the traditional lineup represented by the LQFP package. To address this demand, we have added a 64-pin BGA product that fits within a 6mm square while securing a 0.65mm ball pitch, as well as a 144-pin BGA package that is small in size at 7mm square but can use many pins. With these additions, it is now possible to consider the RA4M3, RA6M4, and RA6M5 for implementation even in small equipment.
For example, in applications with extremely limited space, such as optical cables, where high performance and security are crucial, the RA6M5 BGA package proves to be highly effective. It comes equipped with a Cortex-M33 core, capable of operating up to 200MHz, achieving an impressive CoreMark® benchmark score of 790.76. Additionally, it features a secure cryptographic engine (SCE9), which enables data communication encryption and decryption processes to be executed several times faster with SCE9 than with software, freeing up the CPU to be allocated for other tasks.
In implementing SSL/TLS communication, using SCE9 allows for the removal of external secure elements. This not only eliminates the need for implementation space for external secure elements but also provides benefits such as the removal of limitations due to bus connections and contributes to lower power consumption as shown in the table below.
| Item | Common MCU + External Element | RA6M5 / RA6M4 / RA4M3 |
|---|---|---|
| Implementation Area | Two devices area (larger) | One device area (smaller) |
| Bus Connection Limitations | Throughput due to serial bus connection (Data processing: MCU, Key: SE) | No limitations due to bus connections No need for secure communication outside the chip |
| Power Consumption | Power consumption for two devices | Power consumption for one device (lower) |
| Cost | Increased cost due to secure element unit price Consumption of several extra terminals | Easy to add algorithms. No restrictions on key storage. |
| Flexibility | Limited applicable cryptographic algorithms Restrictions on the number of keys | Easy to add algorithms. No restrictions on key storage. |
Additionally, by utilizing SCE9, it is possible to implement secure key installation to prevent duplication, IP theft, and infrastructure intrusion, as well as secure boot and secure firmware updates to keep the deployed products up-to-date and protected from the latest security threats. For more detailed information, please visit Renesas.com/iot-security.
Let us introduce another implementation example for voice recognition applications.
In recent years, both the rapid adoption of IoT technology and the global outbreak of COVID-19 have led to an accelerated push for voice technology, resulting in a dramatic increase in global demand for voice recognition. Especially for IoT endpoints such as home appliances, portable devices, medical devices, and industrial equipment, that place emphasis on understanding a limited number of words, while implementation space is often limited. Additionally, in adding functions to existing products, small packages and high-performance MCUs are often required. Specifically, this applies to applications such as cameras, portable electronic devices, and smart bulbs.
Furthermore, our software partner, Cyberon, provides proven voice recognition solutions that support evaluation to mass production. For more detailed information, please visit the Cyberon DSpotter solution page.
We hope you find the implementation examples of the newly mass-produced BGA package products for the RA6M5, RA6M4, and RA4M3 series compelling. It's worth noting that we not only mass-produce these products, but we also provide valuable software tools to support your initial evaluations and design stages.
If you're intrigued by these offerings, we invite you to explore the details further on each product's dedicated page. We're confident you'll find the perfect solution for your needs.
RA4M3 Key Features:
- 100MHz Arm® Cortex®-M33 with TrustZone®
- Secure element functionality
- 512kB - 1MB Flash memory and 64kB SRAM with parity and 64kB SRAM with ECC
- 8kB Data Flash to store data as in EEPROM
- 1kB Stand-by SRAM
- Scalable from 64-pin to 144-pin packages
- Capacitive touch sensing unit (CTSU)
- USB 2.0 Full Speed
- CAN 2.0B
- Quad SPI
- SCI (UART, Simple SPI, Simple I2C)
- SPI/I2C multi-master interface
- SDHI and MMC
Please visit the product page for more information: renesas.com/ra4m3
RA6M4 Key Features:
- 200MHz Arm Cortex-M33 with TrustZone
- Secure element functionality
- 1MB - 2MB Flash memory and 448kB SRAM with Parity and 64kB SRAM with ECC
- Dual-bank-Flash with background operation, and block swap functionality
- 8kB Data Flash to store data as in EEPROM
- Scalable from 100-pin to 176-pin packages
- Ethernet controller with DMA
- Capacitive touch sensing unit
- USB 2.0 High-Speed and Full Speed
- CAN FD (CAN 2.0B option)
- Quad SPI and Octa SPI
- SCI (UART, Simple SPI, Simple I2C)
- SPI/ I2C multimaster interface
- SDHI and MMC
Please visit the product page for more information: renesas.com/ra6m4
RA6M5 Key Features:
- 200MHz Arm Cortex-M33 with TrustZone
- Secure element functionality
- 1MB - 2MB Flash memory and 448kB SRAM with Parity and 64kB SRAM with ECC
- Dual-bank-Flash with background operation, and block swap functionality
- 8kB Data Flash to store data as in EEPROM
- Scalable from 100-pin to 176-pin packages
- Ethernet controller with DMA
- Capacitive touch sensing unit
- USB 2.0 High-Speed and Full Speed
- CAN FD (CAN 2.0B option)
- Quad SPI and Octa SPI
- SCI (UART, Simple SPI, Simple I2C)
- SPI/ I2C multimaster interface
- SDHI and MMC
Please visit the product page for more information: renesas.com/ra6m5
For a general overview of working with all RA family devices, please refer to our RA Guide Book.
For details on some of the unique features of RA MCUs, please explore the following blog articles:
- The Asynchronous General Purpose Timer, Providing RA Microcontrollers with Low Power Timing Solutions
- Creating Reliable Crystal Oscillators Circuits for Your MCU Design
- The Event Link Controller – Automatically Manage Low Level System Tasks on RA MCUs
- Creating autonomous I/O systems without the need for CPU intervention
- The Data Transfer Controller – a flexible way to transfer data
If you are interested in learning about a better way to migrate to a higher security level in your application, please read about the cost-effective, easy-to-use Secure Crypto Engine in the Secure Key Installation with Free DLM Service article.