Title Information
Pkg. Name
Name used to describe Renesas packages.
 J20.A
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
 HBG
Package Description
Descriptive text for this package.
 20 TER CLCC, SOLDER SEAL
Package Status
 Active
Package Type
 CLCC
Class
 HERMETIC
Package Code
The unique identifier of this package.
 HBG
Category
 HERMETIC
Lead Count
 20
Pb (Lead) Free
 Yes
Length
 8.89mm
Width
 8.89mm
Thickness
Seated height or Package height
(Please check the outline drawing)
 0mm
Pitch
 1.27mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
 8.89 x 8.89 x 0.00

Documentation
Type Title Date
Package Outline Drawing
j20.a: 20 Pad Ceramic Leadless Chip Carrier Package
PDF 15 KB
1 item