Title | Information |
---|---|
Pkg. Name Name used to describe Renesas packages.
|
M20.3 |
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
MDV |
Package Description Descriptive text for this package.
|
Custom 20 Lead SOIC Module w/ Offset Crystal & Ground plane |
Package Status | Active |
Package Type | SOICW |
Class | PLASTIC |
Package Code The unique identifier of this package.
|
MDV |
Category | PLASTIC |
Lead Count | 20 |
Pb (Lead) Free | Yes |
Length | 12.8mm |
Width | 7.49mm |
Thickness Seated height or Package height
(Please check the outline drawing) |
0mm |
Pitch | 1.27mm |
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
12.80 x 7.49 x 0.00 |