Title Information
Pkg. Name
Name used to describe Renesas packages.
M20.3
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
MFL
Package Description
Descriptive text for this package.
Custom 20 LEAD SOIC Module w Offset Crystal & GND Plane
Package Status
Active
Package Type
SOICW
Class
PLASTIC
Package Code
The unique identifier of this package.
MFL
Category
PLASTIC
Lead Count
20
Pb (Lead) Free
Yes
Length
12.8mm
Width
7.49mm
Thickness
Seated height or Package height
(Please check the outline drawing)
0mm
Pitch
1.27mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
12.80 x 7.49 x 0.00

Documentation

Type Title Date
Package Outline Drawing PDF 90 KB
1 item