Title Information
Pkg. Name
Name used to describe Renesas packages.
 V60.5.71X8.46
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
 VPI
Package Description
Descriptive text for this package.
 60 LEADS/BUMPS FCCSP (5.71 x 8.46): Amkor Technology Korea (ATK)
Package Status
 Active
Package Type
 LFBGA
Class
 PLASTIC
Package Code
The unique identifier of this package.
 VPI
Category
 PLASTIC
Lead Count
 60
Pb (Lead) Free
 Yes
Length
 5.71mm
Width
 8.46mm
Thickness
Seated height or Package height
(Please check the outline drawing)
 1.12mm
Pitch
 0.8mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
 5.71 x 8.46 x 1.12

Documentation
Type Title Date
Package Outline Drawing
V60.5.71x8.46: 60 Flip Chip - Chip Scale Package (FCCSP)
PDF 203 KB
1 item