Title Information
Pkg. Name
Name used to describe Renesas packages.
 W8X8.64
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
 WDC
Package Description
Descriptive text for this package.
 8x8 Array 64 Balls, 0.5mm Pitch, Wafer Level Chip Scale (ASE), Chung-Li, Taiwan
Package Status
 Active
Package Type
 WLCSP-TCURDL
Class
 PLASTIC
Package Code
The unique identifier of this package.
 WDC
Category
 PLASTIC
Lead Count
 64
Pb (Lead) Free
 Yes
Length
 4.03mm
Width
 4.03mm
Thickness
Seated height or Package height
(Please check the outline drawing)
 0.6mm
Pitch
 0.5mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
 4.03 x 4.03 x 0.60

Documentation
Type Title Date
Package Outline Drawing
Package Drawing WLCSP-TCURDL 64pin W8X8.64
PDF 160 KB
1 item