Title Information
Pkg. Name
Name used to describe Renesas packages.
 W4X4.16B
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
 WFG
Package Description
Descriptive text for this package.
 4x4 ARRAY 16 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Package Status
 Active
Package Type
 WLCSP-TCURDL
Class
 PLASTIC
Package Code
The unique identifier of this package.
 WFG
Category
 PLASTIC
Lead Count
 16
Pb (Lead) Free
 Yes
Length
 1.66mm
Width
 1.66mm
Thickness
Seated height or Package height
(Please check the outline drawing)
 0.5mm
Pitch
 0.4mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
 1.66 x 1.66 x 0.50

Documentation
Type Title Date
Package Outline Drawing
Package Drawing WLCSP-TCURDL 16pin W4X4.16B
PDF 93 KB
1 item