Title Information
Pkg. Name
Name used to describe Renesas packages.
 W5X7.35
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
 WFY
Package Description
Descriptive text for this package.
 35 Ball WLCSP, 5x7 ARRAY, 0.4mm Pitch - ASECL
Package Status
 Active
Package Type
 WLCSP-BP
Class
 PLASTIC
Package Code
The unique identifier of this package.
 WFY
Category
 PLASTIC
Lead Count
 35
Pb (Lead) Free
 Yes
Length
 2.88mm
Width
 2.14mm
Thickness
Seated height or Package height
(Please check the outline drawing)
 0mm
Pitch
 0.4mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
 2.88 x 2.14 x 0.00

Documentation
Type Title Date
Package Outline Drawing
w5x7.35: 35 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
PDF 152 KB
1 item