Title Information
Pkg. Name
Name used to describe Renesas packages.
 W4X7.28
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
 WNZ
Package Description
Descriptive text for this package.
 4x7 28 Balls, 0.4mm Pitch, WLCSP; Unisem
Package Status
 Active
Package Type
 WLCSP-BP
Class
 PLASTIC
Package Code
The unique identifier of this package.
 WNZ
Category
 PLASTIC
Lead Count
 28
Pb (Lead) Free
 Yes
Length
 2.86mm
Width
 1.66mm
Thickness
Seated height or Package height
(Please check the outline drawing)
 0.5mm
Pitch
 0.4mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
 2.86 x 1.66 x 0.50

Documentation
Type Title Date
Package Outline Drawing
W4x7.28: 28 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
PDF 170 KB
1 item