Title Information
Pkg. Name
Name used to describe Renesas packages.
 W3X3.9H
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
 WPL
Package Description
Descriptive text for this package.
 9 Ball 3x3 Array UltraThin Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
Package Status
 Active
Package Type
 WLCSP-BP
Class
 PLASTIC
Package Code
The unique identifier of this package.
 WPL
Category
 PLASTIC
Lead Count
 9
Pb (Lead) Free
 Yes
Length
 1.45mm
Width
 1.45mm
Thickness
Seated height or Package height
(Please check the outline drawing)
 0.28mm
Pitch
 0.4mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
 1.45 x 1.45 x 0.28

Documentation
Type Title Date
Package Outline Drawing
Package Drawing WLCSP-BP 9pin W3X3.9H
PDF 149 KB
1 item