Title | Information |
---|---|
Pkg. Name | W3X3.9H |
Pkg. Previous Code | WPL |
Package Description | 9 Ball 3x3 Array UltraThin Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch) |
Package Status | Active |
Package Type | WLCSP-BP |
Class | PLASTIC |
Package Code | WPL |
Category | PLASTIC |
Lead Count | 9 |
Pb (Lead) Free | Yes |
Length | 1.45mm |
Width | 1.45mm |
Thickness | 0.28mm |
Pitch | 0.4mm |
Pkg. Dimensions (mm) | 1.45 x 1.45 x 0.28 |