Title Information
Pkg. Name
Name used to describe Renesas packages.
 W5X5.25H
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
 WPO
Package Description
Descriptive text for this package.
 25 Ball 5x5 Array UltraThin Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
Package Status
 Active
Package Type
 WLCSP-BP
Class
 PLASTIC
Package Code
The unique identifier of this package.
 WPO
Category
 PLASTIC
Lead Count
 25
Pb (Lead) Free
 Yes
Length
 2.07mm
Width
 2.07mm
Thickness
Seated height or Package height
(Please check the outline drawing)
 0.28mm
Pitch
 0.4mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
 2.07 x 2.07 x 0.28