Title Information
Pkg. Name
Name used to describe Renesas packages.
 W6X6.36D
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
 WPZ
Package Description
Descriptive text for this package.
 6x6 36 balls, 0.4mm Pitch, WLCSP; ASE Chung-Li
Package Status
 Active
Package Type
 WLCSP-BP
Package Code
The unique identifier of this package.
 WPZ
Category
 PLASTIC
Lead Count
 36
Pb (Lead) Free
 Yes
Length
 2.41mm
Width
 2.41mm
Thickness
Seated height or Package height
(Please check the outline drawing)
 0.5mm
Pitch
 0.4mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
 2.41 x 2.41 x 0.50

Documentation
Type Title Date
Package Outline Drawing
W6x6.36D: 36 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
PDF 152 KB
1 item