Title Information
Pkg. Name
Name used to describe Renesas packages.
 W5X7.35D
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
 WQQ
Package Description
Descriptive text for this package.
 5x7 35 Balls, 0.4mm Pitch, WLCSP - UAT
Package Status
 Active
Package Type
 WLCSP-TKCURDL
Package Code
The unique identifier of this package.
 WQQ
Category
 PLASTIC
Lead Count
 35
Pb (Lead) Free
 Yes
Length
 3.4mm
Width
 2.39mm
Thickness
Seated height or Package height
(Please check the outline drawing)
 0.5mm
Pitch
 0.4mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
 3.40 x 2.39 x 0.50

Documentation
Type Title Date
Package Outline Drawing
W5x7.35D: 35 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
PDF 150 KB
1 item