Overview
Description
The ZSSC3027 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital conversion of a differential input signal. Designed for high-resolution altimeter module applications, the ZSSC3027 can perform offset, span, and 1st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge sensors, it can also provide a corrected temperature output measured with an internal sensor. The measured and corrected bridge values are provided at the digital output pins, which can be configured as either I2C (≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via an 18-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, non-volatile, multiple-time programmable (MTP) memory. Programming the ZSSC3027 is simple via the serial interface. The IC-internal charge pump provides the MTP programming voltage. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. The ZSSC3027 provides accelerated signal processing in order to support high-speed control, safety, and real-time sensing applications. It complements IDT's ZSSC30x6 products.
Features
- Flexible, programmable analog front-end design, up to 16-bit scalable, charge-balancing two-segment analog-to-digital converter (ADC)
- Fully programmable gain amplifier accepting sensors from 14 to 72 (linear factor)
- Internal auto-compensated temperature sensor
- Digital compensation of individual sensor offset
- 1st and 2nd order digital compensation of sensor gain as well as of 1st and 2nd order temperature gain and offset drift
- Layout optimized for stacked-die bonding for high-density chip-on-board assembly
- Typical sensor elements can achieve accuracy of better than ±0.10% full-scale output @ -40°C to 85°C
Comparison
Applications
Documentation
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| Type | Title | Date |
| Datasheet | PDF 824 KB | |
| Overview | PDF 2.92 MB 日本語 | |
| End Of Life Notice | PDF 1.11 MB | |
| Datasheet - Short-form | PDF 238 KB | |
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Design & Development
Models
ECAD Models
Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.
| WAFER | 0 | -40 to 85°C | Wafer | 0 |
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Videos & Training
A brief introduction and overview of IDT's (acquire by Renesas) sensor signal conditioner evaluation kits. Evaluation kits generally consist of three parts: a communication interface board, a device board, and a sensor simulator board - all connected together. A sophisticated software GUI accompanies the kit, enabling an engineer to learn how to use the part rapidly, do quick prototyping, and practice calibrations.
Presented by David Grice, applications engineer at IDT. For more information about IDT's sensor signal conditioner products, visit the Sensor Signal Conditioner page.