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Homepage Banner showcasing Renesas' DSC 8x8 GaN chip placed on a datacenter technological background.

650V GaN in New
Dual-Cooled 8×8 Pkg

High-Density Power Conversion
for 800V DC Power Architectures

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RZG3L-RZG3SE Homepage Banner 3850 x 1160

New 64-Bit Industrial MPUs
RZ/G3L and RZ/G3SE

Pin-Compatible MPUs Cover
Everything from HMI to IoT
on the Same PCB

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Humanoid-HP

Designing Humanoids
Takes a Team

Strong Ecosystem Collaboration
Builds Intelligent Systems

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FMS-newsroom

Gen 3 MRDIMM
Chipset for AI

Up to 16,000 MT/s
Advancing DDR5 Performance

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Blog Posts

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Main blog image showing applications that use the RH4Z2502 single-channel IO-Link transceiver.
Rethinking IO-Link Device Development: A Faster, More Cost-Effective Path to Market
By Christian Thon, Sr. Product Manager
Main blog image for the How to "Achieve More Power in Less Space with GaN" blog.
How to Achieve More Power in Less Space with GaN
By Stockton Wu, Principal System Engineer
Main image for the Improving Safety for Automotive Head-Up Display (HUD) Systems blog.
Improving Safety for Automotive Head-Up Display (HUD) Systems
By Jonpaul Jandu, Director of Product Marketing
Cuckoo_products

Preventing Boil‑Overs: CUCKOO’s AI‑Powered Induction Range

In collaboration with Renesas, CUCKOO developed an AI-enabled Induction cooktop that detects boiling through Reality AI software trained on boil-over sounds and vibrations.

Read this Success Story

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