R-Car-E3e

Features

• Suitable solution for large panel full graphics cluster system
• Performance and functions optimized for entry-level integrated cockpit systems
• Compatibility with previous products enables use of existing ecosystem and access to over 250* R-Car Consortium partners (*as of Oct, 2018)

Specifications

• Product No: R-Car E3e (R8A779M6)
• Power supply voltage: 3.3/1.8V (IO), 2.5V (Ether), 1.35V (DDR3L), 1.03V (core)
• CPU core
  • Arm^® Cortex^®-A53 Dual
  • Arm^® Cortex^®-R7 Dual Lock-Step
• Cache memory
  • Arm^® Cortex^®-A53 Dual
    • L1 Instruction cache: 32KB
    • L1 Operand cache: 32KB
    • L2 cache: 256KB
  • Arm^® Cortex^®-R7 Dual Lock-Step
    • L1 Instruction cache: 32KB
    • L1 Operand cache: 32KB
• External memory
  • DDR3L-SDRAM
  • Approved standards: DDR3L-1866
  • Data bus width: 32 bits x 1 ch
• Graphics
  • 3D Graphics Processing Unit
  • Imagination Technologies' PowerVR^® Series 8XE GE8300
  • 2D Graphics Processing Unit
• Video
  • Display Out x 2 ch (LVDS x 2 or LVDS + Digital RGB)
  • Video Input x 2 ch (MIPI CSI2, Digital RGB)
  • Up and down scaling, 1-D LUT/3D-LUT/1D-Histogram/2D-Histgram, color conversion, I/P conversion, super resolution, rotate, ordered dithering, sharpness, lossless compression/decompression, lossy compression
  • Distortion compensation module (IMR-LX4)
• Video output check
  • Display Output Compare Unit (DISCOM)
  • Video-Output-Checker (VOC)
• Audio
  • Audio DSP
  • Sampling rate converter × 10 ch
  • Serial sound interface × 10 ch
• Storage interfaces
  • USB 3.0 host interface (DRD) × 1 port (wPHY)
  • USB 2.0 host/function interface × 1 port (wPHY)
  • SD host interface × 3 ch (SDR104)
  • Multimedia card interface × 1 ch
  • PCI Express (1 lane) x 1 ch
  • Raw NAND Flash memory interface x 1 ch
• In-car network and automotive peripherals
  • Media local bus (MLB) interface × 1 ch (3-pin interface)
  • Controller area network (CAN-FD support) interface × 2ch
  • Ethernet AVB 1.0-compatible MAC built in
  • Interface: RGMII
  • Ethernet AVB (802.1BA)
    • IEEE802.1BA
    • IEEE802.1AS
    • IEEE802.1Qav
    • IEEE1722
• Security
  • Crypto engine (AES, DES, Hash, RSA)
  • SystemRAM
• Other peripherals
  • SYS-DMAC x 48 ch, Realtime-DMAC x 16 ch, Audio-DMAC x 16 ch, Audio(peripheral)-DMAC x 29 ch
  • 32-bit timer x 26 ch
  • PWM timer × 7 ch
  • I²C bus interface × 9 ch
  • Serial communication interface (SCIF) × 11 ch
  • SPI multi I/O bus controller (RPC) × 2 ch (HyperFlash™/QSPI support)
  • Clock-synchronized serial interface (MSIOF) × 4 ch (SPI/IIS)
  • Digital radio interface (DRIF) × 4 ch
• Low power mode
  • Dynamic Power Shutdown
  • DFS (Dynamic Frequency Scaling), DDR-SDRAM power supply backup mode
• Package: 552-pin Flip chip BGA (21 mm x 21 mm, 0.8 mm pitch)
• Development environment: ICE for Arm CPU available from tool vendors
• Evaluation board: A user system development reference platform with the following features is also available to enable the users to carry out efficient system development.
  • Incorporates car information system-oriented peripheral circuits, providing users with an actual device verification environment.
  • Can be used as a software development tool for application software, etc.
  • Allows easy implementation of custom user functions.
• Software Platform
  • Supported OS: Linux, QNX^® Neutrino^® RTOS, Integrity^® etc.
  • OpenGL ES3.1 3D graphics library, Wide variety of H.265, H.264, MPEG-4 and VC-1 for video compliant with OpenMAX IL I/F in addition to BSPs compliant with OSs standard API are available to realize complete system concept.

Arm and Cortex are registered trademarks of Arm Limited.
PowerVR is a trademark of Imagination Technologies Limited.
QNX, neutrino and Blackberry are trademarks from BlackBerry Limited, and are used with permission from QNX Software System Limited.
Green Hills Software and INTEGRITY are trademarks or registered trademarks of Green Hills Software, Inc. in the U.S. and/or internationally.
HyperFlash is a trademark of Spansion LLC in the United States and other countries.
All names of other products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.

Comparison

Applications