Overview

The TS5111 DDR5 Temperature Sensor is a new precision temperature sensor targeted at DDR5 RDIMMs, LRDIMMs and some high-end Gaming DIMMs. Due to its high precision, low power and small footprint, the IC is also well suited for any application that requires a temperature sensor, including Solid State Disks (SSD), embedded computing motherboards, portable devices, and communications equipment. The new Temperature Sensor allows these various applications to run at peak efficiency, saving overall power and enhancing reliability and performance with real-time, closed-loop thermal management algorithms.

The TS5111 has programmable warning flags that enable systems to exercise thermal control loop mechanisms such as memory refresh rates, fan seeds, bandwidth throttling and allows for upper and lower temperature limits. With package dimensions of 0.8 x 1.3mm the temperature sensor can be placed in virtually any location where proximity sensing is critical for reliable operation.

The TS5111 supports I²C, SMBUS, as well as the new I3C Basic protocol for data rates up to 12.5 Mbits/sec, and other advanced features like in-band interrupts, parity checking, and packet error checks.

TS5111 - Block Diagram
TS5111 - Block Diagram
  • Two-wire bus serial interface (I2C and I3C operation modes)
  • Up to 12.5MHz transfer rate
  • Single 1.8V and optionally a 1.0V power supply input
  • Packet Error Check (PEC) function
  • Parity Error Check function
  • 0.5°C accuracy with 0.25°C resolution
  • Supports 1.0V, 1.1V, and 1.2V push-pull IO levels
  • Supports 1.0V, 1.1V, 1.2V, 1.8V, 2.5V, and 3.3V open-drain IO levels
  • Bus Reset function
  • Two unique addresses selected by SA pin
  • Programmable I2C or I3C bus addressing scheme
  • In Band Interrupt (IBI) (Transparent Mode of Operation)

Documentation

= Featured Documentation
Type Title Date
Datasheet - Short-form
TS5111 Short-Form Datasheet
Log in to Download PDF 78 KB
Product Change Notice
PCN# : 240018 Add SFA, Korea as alternate wafer sort location (CP1)
PDF 280 KB
Product Change Notice
PCN# : 210020 Add Alternate Bump Location and Backend Location on WLCSP6 Package
PDF 677 KB
Product Advisory
PA# : PA210010 Add Additional Manufacturing Locations for DDR5 Temp Sensor in WLCSP6
PDF 1.21 MB
4 items

Design & Development

ECAD Models

Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.

Explore ECAD Models
Diagram of ECAD Models

Product Options

    Processing table
    EPC
    Pkg. Type
    Lead Count (#)
    Carrier Type
    Comm. Interface
    Temp. Range
    Moisture Sensitivity Level (MSL)
    Buy / Sample
    Part Number
    TS5111-Z2AHRI
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    memory
    view_in_ar
    Samples Available
    		 AHR6 WLCSP 6 Cut Tape I2C, I3C -40 to 85°C 1 Get Samples,
    TS5111-Z2AHRI8
    circleActive
    memory
    view_in_ar
    Samples Available
    		 AHR6 WLCSP 6 Reel I2C, I3C -40 to 85°C 1 Get Samples,
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