Overview
Description
The CD4069UBMS CMOS hex inverters consist of six CMOS inverter circuits. These devices are intended for all general-purpose inverter applications where the medium-power TTL-drive and logic level conversion capabilities of circuits such as the CD4009 and CD4049 hex inverter/buffers are not required. The CD4069UBMS is supplied in these 14-lead outline packages: Braze Seal DIP H4H, Frit Seal DIP H1B and Ceramic Flatpack H3W.
Features
- High-voltage types (20V rating)
- Standardized symmetrical output characteristics
- Medium-speed operation: tPHL, tPLH = 30ns (typ) at 10V
- 100% tested for quiescent current at 20V
- Maximum input current of 1µA at 18V over full package temperature range; 100nA at 18V and +25 °C
- Meets all requirements of JEDEC tentative standard No. 13B, "Standard Specifications for Description of 'B' Series CMOS Devices"
Comparison
Applications
- Logic inversion
- Pulse shaping
- Oscillators
- High-input impedance amplifiers
Documentation
Featured Documentation
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| Type | Title | Date |
| Datasheet | PDF 406 KB | |
| Brochure | PDF 5.02 MB | |
| Brochure | PDF 467 KB | |
| Price Increase Notice | PDF 360 KB | |
| Other | ||
| Product Advisory | PDF 499 KB | |
| Product Change Notice | PDF 230 KB | |
| Application Note | PDF 338 KB | |
| Application Note | PDF 224 KB | |
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Design & Development
Models
ECAD Models
Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.
Processing table
| SBDIP | 14 | Tube | Not Applicable | 19.0 x 7.4 x 2.41 | 5962R9665301VCC | Yes | Gold Plate over compliant Undercoat-e4 | 25 | -55 to +125°C | |||
| CFP | 14 | Tray | Not Applicable | 9.8 x 6.5 x 0.00 | 5962R9665301VXC | Yes | Gold Plate over compliant Undercoat-e4 | 25 | -55 to +125°C |
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