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IoT Remote Sensing System

Overview

Description

This cellular cloud-connected design streamlines the secure linkage of devices to the cloud. It collects sensor data and transmits it through a cellular modem or an Ethernet port. The Flexible Software Package (FSP) provides a versatile platform for building secure, connected IoT devices with production-ready drivers, Azure® RTOS, FreeRTOS™, and additional middleware stacks. This approach facilitates the efficient development of remote sensing applications with strong connectivity and data management capabilities.

System Benefits​:

  • Facilitates rapid development of cloud-connected devices using MCUs.
  • Provides LTE Cat-M1 cellular connectivity via Pmod™ for extensive network coverage.
  • Offers flexible expansion through Pmod and Arduino interfaces.
  • Seamlessly integrates with Azure or AWS cloud services using the Flexible Software Package (FSP).
  • Includes sensors for comprehensive monitoring of humidity, temperature, pressure, and air quality.

Comparison

Applications

  • Remote monitoring
  • Health devices
  • Endpoint artificial intelligence (AI)/machine learning (ML)

Winning Combinations Interactive Diagram

Select a block to discover products for your design

4:3 ratio Sheet.1 Sheet.2 Sheet.3 Sheet.4 US014 US014 US014 LDO LDO LDO Buck Regulator Buck Regulator Buck Regulator USB USB USB MEMs Microphone MEMs Microphone MEMs Microphone MEMs Microphone MEMs Microphone MEMs Microphone QSPI FLASH QSPI FLASH QSPI FLASH BIO Sensor BIO Sensor BIO Sensor OAQ Sensor OAQ Sensor OAQ Sensor Humidity/Temperature Sensor Humidity/Temperature Sensor Humidity/Temperature Sensor IAQ Sensor IAQ Sensor IAQ Sensor 9-Axis MEMs Motion Sensor 9-Axis MEMs Motion Sensor 9-Axis MEMs Motion Sensor Barometric Pressure Sensor Barometric Pressure Sensor Barometric Pressure Sensor Level Shifter Level Shifter Level Shifter PHY PHY PHY RJ45 RJ45 RJ45 Wi-Fi Bluetooth Module Wi-Fi Bluetooth Module Wi-Fi Bluetooth Module LTE-M Module GM01Q LTE-M Module GM01Q LTE-M Module GM01Q Sheet.33 Sheet.34 Sheet.37 Sheet.38 Sheet.39 Sheet.40 Sheet.41 Sheet.42 Sheet.43 Sheet.44 Sheet.45 Sheet.46 Sheet.47 Sheet.48 Sheet.50 Sheet.51 Sheet.52 Sheet.53 Sheet.56 Sheet.57 5.0VDC 5.0VDC 5.0VDC Connector 1.158 1.8V/150mA 1.8V/150mA 1.8V/150mA Sheet.61 3.3V/2000mA5 3.3V/2000mA5 3.3V/2000mA5 3.3V/143mA 3.3V/143mA 3.3V/143mA Sheet.64 Sheet.65 Sheet.66 Sheet.67 Sheet.68 Sheet.69 Sheet.71 Connector 1.158.72 3.3V/600uA 3.3V/600mA 3.3V/600mA 3.3V/600uA 3.3V/600mA 3.3V/600mA 3.3V/20mA 3.3V/20mA 3.3V/20mA Sheet.82 Sheet.83 Sheet.85 Sheet.86 Sheet.94 Connector 1.158.95 Sheet.100 3.3V/320mA 3.3V/320mA 3.3V/320mA Sheet.102 Sheet.103 3.3V/102mA 3.3V/102mA 3.3V/102mA Connector 1.158.106 1.8VDC 1.8VDC 1.8VDC 3.3VDC 3.3VDC 3.3VDC Connector 1.158.110 Sheet.111 Sheet.112 Connector 1.113 SDA/SCL SDA/SCL SDA/SCL Connector 1.158.115 Connector 1.158.116 Connector 1.158.117 3.3V/300mA 3.3V/300mA 3.3V/300mA 3.3V/13mA 3.3V/13mA 3.3V/13mA 3.3V/24.4uA 3.3V/24.4mA 3.3V/24.4mA 3.3V/16.2mA 3.3V/16.2mA 3.3V/16.2mA MCU MCU MCU MCU USB USB USB SSIF SSIF SSIF QSPI QSPI QSPI I2C I2C I2C Ethernet Ethernet Ethernet GPIO SPI GPIO SPI GPIO SPI SCI GPIO SCI GPIO SCI GPIO Pmod Type 3A Pmod Type 3A Pmod Type 3A Connector double arrow Connector double arrow.127 Sheet.129 3.3V/320mA.130 3.3V/485mA 3.3V/485mA Pmod Type 3A Pmod Type 3A Pmod Type 3A Connector double arrow.134
Exiting Interactive Block Diagram

Software

Software & Tool Pages

Software title
Software type
Company
RA Flexible Software Package (FSP)
FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers. Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain, and Segger J-Link drivers required to use this software. No additional installations are required.
Software Package Renesas
1 item

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