Overview

Description

This cellular cloud connected system greatly simplifies the challenge of connecting your product securely to the cloud. In this design, sensor data is collected and sent to the cloud via the cellular modem or ethernet port. Our Flexible Software Package (FSP) provides a quick and versatile way to build secure, connected IoT devices using production-ready drivers, Azure® RTOS, FreeRTOS™, and other middleware stacks.

System Benefits​:

  • Rapid development of a cloud-based solution
  • RA6M5 or RX65N MCU options
  • Cat-M1 cellular PMOD™
  • PMOD and Arduino expansion
  • FSP with AZURE or AWS cloud/dashboard integration
  • Sensors for:
    • Humidity, temperature, pressure, and air quality
    • Heart rate, SpO2 and respiration rate
    • 2 x MEMS microphones

Comparison

Applications

Applications

  • Remote monitoring
  • Health devices
  • Endpoint artificial intelligence (AI)/machine learning (ML)

Winning Combinations Interactive Diagram

Select a block to discover products for your design

4:3 ratio Sheet.1 Sheet.2 Sheet.3 Sheet.4 US014 US014 US014 LDO LDO LDO Buck Regulator Buck Regulator Buck Regulator USB USB USB MEMs Microphone MEMs Microphone MEMs Microphone MEMs Microphone MEMs Microphone MEMs Microphone QSPI FLASH3 QSPI FLASH QSPI FLASH BIO Sensor BIO Sensor BIO Sensor QAQ Sensor QAQ Sensor QAQ Sensor Humidity/Temperature Sensor Humidity/Temperature Sensor Humidity/Temperature Sensor IAQ Sensor IAQ Sensor IAQ Sensor 9-Axis MEMs Motion Sensor 9-Axis MEMs Motion Sensor 9-Axis MEMs Motion Sensor Barometric Pressure Sensor Barometric Pressure Sensor Barometric Pressure Sensor Level Shifter Level Shifter Level Shifter PHY PHY PHY RJ45 RJ45 RJ45 Wi-Fi Bluetooth Module Wi-Fi Bluetooth Module Wi-Fi Bluetooth Module LTE-M Module GM01Q LTE-M Module GM01Q LTE-M Module GM01Q Sheet.33 Sheet.34 Sheet.37 Sheet.38 Sheet.39 Sheet.40 Sheet.41 Sheet.42 Sheet.43 Sheet.44 Sheet.45 Sheet.46 Sheet.47 Sheet.48 Sheet.50 Sheet.51 Sheet.52 Sheet.53 Sheet.56 Sheet.57 5.0VDC 5.0VDC 5.0VDC Connector 1.158 1.8V/150mA 1.8V/150mA 1.8V/150mA Sheet.61 3.3V/2000mA5 3.3V/2000mA5 3.3V/2000mA5 3.3V/143mA 3.3V/143mA 3.3V/143mA Sheet.64 Sheet.65 Sheet.66 Sheet.67 Sheet.68 Sheet.69 Sheet.71 Connector 1.158.72 3.3V/600uA 3.3V/600mA 3.3V/600mA 3.3V/600uA 3.3V/600mA 3.3V/600mA 3.3V/20mA 3.3V/20mA 3.3V/20mA Sheet.82 Sheet.83 Sheet.85 Sheet.86 Sheet.94 Connector 1.158.95 Sheet.100 3.3V/320mA 3.3V/320mA 3.3V/320mA Sheet.102 Sheet.103 3.3V/102mA 3.3V/102mA 3.3V/102mA Connector 1.158.106 1.8VDC 1.8VDC 1.8VDC 3.3VDC 3.3VDC 3.3VDC Connector 1.158.110 Sheet.111 Sheet.112 Connector 1.113 SDA/SCL SDA/SCL SDA/SCL Connector 1.158.115 Connector 1.158.116 Connector 1.158.117 3.3V/300mA 3.3V/300mA 3.3V/300mA 3.3V/13mA 3.3V/13mA 3.3V/13mA 3.3V/24.4uA 3.3V/24.4mA 3.3V/24.4mA 3.3V/16.2mA 3.3V/16.2mA 3.3V/16.2mA MCU MCU MCU MCU USB USB USB SSIF SSIF SSIF QSPI QSPI QSPI I2C I2C I2C Ethernet Ethernet Ethernet GPIO SPI GPIO SPI GPIO SPI SCI GPIO SCI GPIO SCI GPIO PMOD Type 3A PMOD Type 3A PMOD Type 3A Connector double arrow Connector double arrow.127 Sheet.129 3.3V/320mA.130 3.3V/485mA 3.3V/485mA Wi-Fi Bluetooth Module.131 PMOD Type 3A PMOD Type 3A Connector double arrow.134
Exiting Interactive Block Diagram

Software

Software & Tool Pages

Software title
Software type
Company
RA Flexible Software Package (FSP)
FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers. Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain, and Segger J-Link drivers required to use this software. No additional installations are required.
Software Package Renesas
1 item