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Renesas Reimagines Remote Design With Enhanced Lab on the Cloud Environment

Cloud-Connected Lab Accelerates Board Configuration with Advanced New GUI and Testing for Voice, Mobile, and other Complex Applications

September 7, 2021

TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced today that it has expanded its popular Lab on the Cloud environment to simplify the configuration and testing process and speed time to market. Renesas has enhanced its cloud-connected lab with new advanced GUI features and new design parameters that create a more engaging and ergonomic user experience, and offer designers greater configuration flexibility.

Lab on the Cloud enables customers to remotely access, configure, test, monitor, and measure Renesas solutions instantly 24/7 in a full-fledged, cloud-connected lab. It includes evaluation boards for popular devices, proof of concept boards from Renesas’ Winning Combinations, and other solutions from Renesas partners. Users can access the physical lab through a convenient PC-based GUI that instantly enables them to immediately begin configuring and testing designs without requiring a physical board in hand.

The new user-friendly GUI introduces new parameters for control and additional results for monitoring. The ergonomic lab layout, advanced features, and intuitive user interface make it easier for users to quickly navigate the environment. For instance, the centralized live camera feed gives users a live view of the complete lab setup and results, including the ability to zoom in and out on real-time testing and data capture readings.

Advanced implementations in test setups and control for voice recognition, mobile application, and power supply enable users to complete complex testing such as transient performance in just a few clicks of the mouse.

Renesas also added several new options for components such as the Renesas Femtoclock2 point-of-use timing devices, the smallest and lowest power <100fs clock generation and jitter attenuation solution available on the market. Providing customers with Lab On the Cloud accessibility makes testing these high-performance devices easier than ever, accelerating designs and ensuring that even the most stringent performance requirements are met. In addition, Renesas added several new sections to the Lab on the Cloud suite including timing, power supply, voice recognition and control, healthcare, safety and surveillance, industrial communication, and IEEE 1588/5G computing and communication.

“As application requirements continue to change rapidly, customers are looking for a powerful yet flexible and easy-to-use approach to design configuration and testing,” said DK Singh, Senior Director of the System and Solutions Team at Renesas. “We are continually working to make designing with Renesas products easier and faster, and the enhanced Lab on the Cloud environment takes product selection and testing capabilities to the next.”

Renesas has also introduced 14 popular evaluation boards to the Lab on the Cloud environment. The Renesas Lab on the Cloud now boasts 23 different boards addressing diversified application segments with a variety of devices.

The new boards are:

For more information on Lab on the Cloud, please visit www.renesas.com/labonthecloud. For more information on Renesas’ more than 250 Winning Combinations, please visit: www.renesas.com/WIN.

About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live. A global leader in microcontrollers, analog, power, and SoC products, Renesas provides comprehensive solutions for a broad range of automotive, industrial, infrastructure, and IoT applications that help shape a limitless future. Learn more at renesas.com. Follow us on LinkedIn, Facebook, Twitter, YouTube and Instagram.

(Remarks) All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.


The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.

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