From 21-23 June, Renesas was one of the largest semiconductor manufacturers at Embedded with a 170m2 stand. In addition to numerous solutions for industry, such as IoT, wireless connectivity, and sensor solutions, many solutions for the automotive sector were shown, grouped around three central themes: E/E Architecture Change, ADAS, and Electric Car.
E/E Architecture
Renesas presented a Communication Gateway enabling secure data connection between the connected car and cloud services based on R-Car S4; on top of that, a Zone ECU application was showcased, using RH850/U2B. To practically reduce the overall number of ECUs in a car, their functions must become integrated as multiple virtual ECUs on a shared physical ECU. A solution to this challenge is the introduction of a hypervisor-related software system – developed in cooperation between ETAS and Renesas. In addition, Renesas introduced an e-Fuse Board, based on intelligent power devices (IPD). Electronic fusing is an essential concept of future power distribution systems; e-fuses offer maintenance-free handling. The topic of E/E architecture was rounded off by an automotive network demonstrator, featuring the new 10Mbit communication standards: CAN XL and 10Base-T1S. The demonstrator showed vividly how software design and hardware accelerators can lower processing demand in gateway applications efficiently.
ADAS
Renesas used the exhibition platform to show a smart camera solution, featuring R-Car V3H and V2M. This ADAS system solution is a ready-to-use development environment for intelligent cameras based on the Deep Learning EagleCAM from Renesas’ ecosystem partner LUPA.
As a novelty, R-Car V4H was presented, a new member of the R-Car family for Automated Driving Level 2+/3 - balancing innovation and automotive constraints. A turnkey solution for imaging radar was also presented, as well as PMICS specifically tailored to Renesas R-Car SoCs.
xEV
Renesas showcased three so-called ‘Winning Combinations’ – compelling Renesas + Intersil + IDT + Dialog product combinations highlighting the technological advantages Renesas and the three acquired companies can provide as a combined company. These combinations deliver comprehensive solutions that help customers accelerate their designs and get to market faster:
- Wireless battery management – Combining an MCU, BMIC (cell balancing IC), and wireless transceiver as well as application model and software.
- Inductive position sensor - A resolver replacement to optimize costs, reduce weight and size, and support the most challenging functional safety-critical automotive applications.
- 48V auxiliary inverter - A cost-effective solution, based on a resolverless position sensor concept with reduced chipset, improved levels of functional integration, and proven interoperability of all components.
The solutions presented at Renesas’ booth made it clear that Renesas is no longer a pure MCU and SoC supplier, but the portfolio has been significantly expanded with analog and power products to offer complete solutions.
Although there were fewer visitors and exhibitors at the fair this year than in the past, we had a busy time of information exchange, discovery of news and trends, and a vast number of customer meetings. The best thing about the show was finally being able to talk to people face-to-face again after 2.5 years of the pandemic. The joy was definitively palpable.
We will be happy to see you again at Electronica in Munich!