What’s New in Bluetooth® 5.3 Low Energy
This blog presents an overview of the latest Bluetooth Low Energy (LE) specification release 5.3 and the value those new features will bring to Renesas customers and their next-generation designs.
This blog presents an overview of the latest Bluetooth Low Energy (LE) specification release 5.3 and the value those new features will bring to Renesas customers and their next-generation designs.
Providing coverage across all mainstream Renesas MCUs from 8 to 32 bits, the Renesas Ready Partner Network makes it simple to find and integrate solutions tailored to your requirements.
Various networks can be executed on an MCU using 8-bit quantization, which has a large effect in reducing the ROM/RAM usage of a neural network with little decrease in accuracy, an ideal function for MCUs.
In this post, we will look at how the 10BASE-T1S and CAN XL protocols could be used in a system and what is necessary to connect CAN XL and 10BASE-T1S to an IVN backbone.
Introducing the I3C interface for DDR5 DIMM LED control solution based on new entry-level RA Family RA2E2 MCU Group.
Introducing a new board feature of the Smart Configurator tool that will assist in selecting software components (i.e., middleware and drivers) that will work nicely with your Renesas board.
In this blog, we will explain how Renesas contributes with the new R-Car S4 based chipset to a smarter E/E architecture in the Automotive market.
Learn how to extract the parameters of a user’s own motor using the Renesas Motor Workbench’s tuner function with the RA6T1 MCU and how to fill the parameters into the sample program.
Using the Connected Car Platform - Starter Kit (CCPF-SK), R-Car users can set up the development environment for connected cars easily and quickly and focus on the development of added value software.
In the second entry of this series on automotive radar, the basics of automotive radar will be presented: the principle of FMCW radar, radar processing and the architecture of a radar module.