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DDR4 Solutions

Renesas' DDR4 registered clock driver, data buffer and temp sensor make up the industry’s first complete chipset for DDR4 registered dual inline memory modules (RDIMMs) and load reduced dual inline memory modules (LRDIMMs). With DDR4 data rates climbing to 3.2Gb/s and higher, the clear advantages afforded by RDIMM and LRDIMM as a speed-scalable memory technology are expected to drive adoption across a broad array of memory-intensive computing and storage applications.

Renesas also offers an industrial temp DDR4 RCD that supports temperatures as low as -40 °C and as high as 105 °C for existing DDR4 applications.

Through flexible I/O control, timing and voltage calibration, and control register programmability, the Renesas DDR4 registered clock drivers and data buffers enable faster data rates at higher densities on all JEDEC® defined DDR4 LRDIMM and RDIMM topologies. DIMM topology configuration and DRAM information are stored in Renesas' temperature sensor EEPROM.

With a deep knowledge of memory interface chipsets based on successful chipset introductions for all DDR generations, Renesas’ devices will provide reliable performance for your application.

Product Selector: DDR4 Solutions

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Documentation

Type Title Date
Brochure PDF 3.57 MB
White Paper PDF 1.08 MB
White Paper PDF 5.22 MB
3 items

Videos & Training

How DDR4 LRDIMMs Transcend RDIMMs in Today's Enterprise Servers

A white paper authored by IDT (acquired by Renesas) and Micron details research into memory and bandwidth for today's high-performance servers. LRDIMMS and RDIMMS traditionally have been seen as complementary, with the former targeting applications requiring deeper memory and the latter for applications requiring higher bandwidth. 

The introduction of 8-gigabit DRAMS has resulted in a growing number of Internet applications benefiting from both deeper memories and higher bandwidth. This paper shows how 32 GB 2RX4 LRDIMMs transcend similar RDIMMs to meet the needs of today’s data center enterprise servers, by providing an optimal combination of deeper memory and higher data bandwidth, even at mainstream module densities.

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