Package Information
| Pkg. Type | HXQFN |
| Pkg. Code | pkg_1616 |
| Lead Count (#) | 40 |
| Pkg. Dimensions (mm) | 5 x 5 x 0.5 |
Environmental & Export Classifications
| ECCN | 3A991 |
| RoHS (R5F213J4TNNP#W4) | EnglishJapanese |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| HTSUS |
Product Attributes
| Pkg. Type | HXQFN |
| Carrier Type | Tape & Reel |
| ADC | 10-bit x 12-ch |
| Bit Size | 16 |
| CPU | R8C |
| DMA | Yes |
| Data Flash (KB) | 4 |
| Ethernet | No |
| Family Name | R8C |
| I/O Ports | 31 |
| LVD or PVD | Yes |
| Lead Compliant | Yes |
| Lead Count (#) | 40 |
| Length (mm) | 5 |
| MOQ | 5000 |
| Moisture Sensitivity Level (MSL) | 3 |
| Operating Freq (Max) (MHz) | 20 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 5 x 5 x 0.5 |
| Program Memory (KB) | 16 |
| RAM (KB) | 1.5 |
| RTC | No |
| Supply Voltage (V) | 1.8 - 5.5 |
| Tape & Reel | No |
| Temp. Range | -20 to +85°C |
| Thickness (mm) | 0.5 |
| Timer | 8-bit x 2-ch, 16-bit x 1-ch |
| Width (mm) | 5 |
Description
The R8C/3JT Group is supported only for customers who have already adopted these products. The RX130 Group is recommended for new designs.
The R8C/3JT Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/3JT Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.