The ZSSC3281 is a dual path sensor signal conditioning IC (SSC) for highly accurate amplification, digitization, and sensor-specific correction of sensor signals. The ZSSC3281 is suitable for bridge and half-bridge sensors, as well as external voltage-source element and single-element sensors (for example, Pt100 and external temperature sensor diodes) powered by an on-chip current source. Digital compensation of the sensor offset, sensitivity, temperature drift, and non-linearity is accomplished via a 32-bit ARM M3 based math core running a correction algorithm with calibration coefficients stored in a non-volatile, reprogrammable memory. The programmable, integrated sensor front-end allows optimally applying various sensors for a broad range of applications.
The ZSSC3281 provides measurement value readouts and programming capabilities via an I2C, SPI, or one-wire interface (OWI). Absolute and ratiometric voltage, current-loop, or interrupt outputs are supported by the ZSSC3281.
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| Type | Title | Date |
| Datasheet | PDF 2.45 MB | |
| Overview | PDF 2.92 MB 日本語 | |
| Technical Brief | PDF 406 KB | |
| Guide | PDF 392 KB | |
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The ZSSC3281KIT Evaluation Kit provides the hardware needed for the configuration, calibration, and evaluation of the ZSSC3281 Sensor Signal Conditioner (SSC) IC. The...
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Description |
Pkg. Type |
Lead Count (#) |
Temp. Range |
Carrier Type |
Moisture Sensitivity Level (MSL) |
Price (USD) | 1ku |
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| Part Number | ||||||||
| 304μm thickness, no inking | WAFER | 0 | -40 to +85°C | Wafer | 1 | |||
| 725μm thickness, no inking | WAFER | 0 | -40 to +125°C | Wafer | 1 | |||
| 13-inch Reel | VFQFPN | 40 | -40 to +85°C | Reel | 1 | |||
| 304μm thickness, with inking | WAFER | 0 | -40 to +85°C | Wafer | 1 | |||
| 725μm thickness, with inking | WAFER | 0 | -40 to +85°C | Wafer | 1 | |||
| 304μm thickness, no inking | WAFER | 0 | -40 to +125°C | Wafer | 1 | |||
| 725μm thickness, no inking | WAFER | 0 | -40 to +125°C | Wafer | 1 | |||
| 13-inch Reel | VFQFPN | 40 | -40 to +125°C | Reel | 1 | 3.419 | Get Samples, | |
| 304μm thickness, with inking | WAFER | 0 | -40 to +125°C | Wafer | 1 | |||
| 725μm thickness, with inking | WAFER | 0 | -40 to +125°C | Wafer | 1 |
Learn about Renesas’ ZSSC3281 industry leading dual path sensor signal conditioning IC for fast and highly accurate amplification, digitization, and application specific correction of sensor signals.
| ZSSC3281: A Quantum Leap in Sensor Signal Conditioning | Blog Post | Jun 22, 2022 |
