Evaluation Kit for RA6M5 MCU Group
The EK-RA6M5 evaluation kit enables users to effortlessly evaluate the features of the RA6M5 MCU Group and develop embedded systems applications using the Flexible...
Featured Documents:
Overview
Description
The CK-RA6M5 cloud kit enables users to securely connect to the cloud and explore the features of the Cortex®-M33 based RA6M5 group of MCUs and cloud services. With multiple network connectivity options, the kit provides a seamless cloud connectivity experience to most of the global cloud service providers. The kit is equipped with an onboard ethernet PHY for ethernet connectivity and includes the DA16600 Wi-Fi-BLE combo Pmod for wireless connectivity. With the Renesas Flexible Software Package (FSP), the kit has complete software stack support using FreeRTOS, Azure RTOS and other middleware stacks, thereby making it an ideal platform for efficiently developing cloud solutions and greatly reducing the time-to-market.
Visit Renesas Cloud Solutions for complete cloud solution package.
Features
- CK-RA6M5 v2 baseboard
- Wi-Fi with US159-DA16600EVZ PMOD
- Ethernet
- USB Full Speed Host and Device
- Sensors:
- Humidity and Temperature
- Indoor Air Quality Index
- Outdoor Air Quality Index
- Heart rate, blood oxygen saturation (SpO2), respiration rate
- Barometric Pressure
- 6 axis Motion Tracking
- 2 MEMS Microphones
- Battery connector for portability
- Arduino™ (Uno R3) connector
- USB Type-C power connector
- On-board MCU
- RF7A6M5BH3CFC microcontroller
- 200MHz, Arm® Cortex®-M33 core
- 2MB Code Flash, 512KB SRAM
- 176 pins, LQFP package
- Ecosystem
- MCU and Pmod current measurement points
- 5V input through USB or external power supply
- USB-serial converter
- Debug on-board (SEGGER J-Link)
- 4 user LEDS
- One user button
- 2 Digilent Pmod™ (SPI/UART/I2C: Type-6A and Type-2A) connectors
Applications
Design & Development
Software & Tools
Software & Tools
| Software title
|
Software type
|
Company
|
|---|---|---|
| RA Flexible Software Package (FSP) FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers.
Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain, and Segger J-Link drivers required to use this software. No additional installations are required.
|
Software Package | Renesas |
| QuickConnect Platform QuickConnect platform enables fast prototyping by providing compatible hardware and software building blocks.
|
Software and Hardware Development Tools | Renesas |
| Reality AI Utilities Plug-in module for Renesas e² studio
|
Solution Toolkit | Renesas |
3 items
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Sample Code
Related Boards & Kits
Ultra-Low-Power Wi-Fi + Bluetooth Low Energy Combo Pmod Board
The US159-DA16600EVZ is a highly integrated ultra-low-power Wi-Fi + Bluetooth® Low Energy (LE) combo Pmod™ module that provides a convenient way to add both low-power...
Featured Documents:
Processing table
RTK7CKA6M5S08002BE Active |
CK-RA6M5 v2 (Wi-Fi, Ethernet) |
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Videos & Training
Cloud Kits with Wi-Fi or Cellular Connectivity
Watch a short overview of the Renesas CK-RA6M5 and CK-RX-65N certified cellular-to-cloud IoT development kits to see how they can simplify solution prototyping for your next IoT design. Visit renesas.com/cloudsolutions to get started.
Video List
News & Blog Posts
| Utilizing the CK-RA6M5 Board to Run Voice AI Apps (Keyword Spotting) Using e-AI Translator | Blog Post | Dec 18, 2023 |
| The IoT Cloud Connection Decision: Wi-Fi or Cellular? | Blog Post | Oct 31, 2023 |
| Empowering Designers to Connect to the Cloud Services of Their Choice | Blog Post | Apr 6, 2023 |
| Renesas Cellular-to-Cloud Development Kits Now Connect Seamlessly to Microsoft Azure Cloud Services | News | Apr 6, 2023 |
| Simplify Cellular-to-Cloud Development with the Renesas Cloud Kits CK-RA6M5 and CK-RX65N | Blog Post | Jun 15, 2022 |
| Renesas Launches Cellular-to-Cloud IoT Development Platforms Powered by RA and RX MCU Families | News | Jun 15, 2022 |