Capacitive Touch Evaluation System for RA2L1
The RA2L1 capacitive touch evaluation system makes it easy for users to evaluate touch solutions offered by Renesas. You can start evaluating immediately out of the box...
CPK-RA2L1 评估板可通过灵活配置软件包 (FSP) 和 e2 studio IDE,帮助用户对RA2L1 MCU 群组的特性进行无缝评估,并对嵌入系统应用程序进行开发。用户可利用丰富的板载功能以及自选的热门生态系统插件来将丰富创意变为现实。
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Type | Title | Date |
Datasheet | PDF 2.07 MB 日本語 | |
Application Note | PDF 2.88 MB | |
Flyer | PDF 534 KB 日本語 | |
Presentation | PDF 7.02 MB | |
Flyer | PDF 446 KB 日本語 | |
White Paper | PDF 660 KB 日本語 , 简体中文 | |
6 items
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Software title
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Software type
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Company
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RA Flexible Software Package (FSP) FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers.
Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain, and Segger J-Link drivers required to use this software. No additional installations are required.
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Software Package | Renesas |
Renesas Flash Programmer (Programming GUI) Flash memory programming software [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, RISC-V MCU Renesas Synergy, DA1453x, DA1459x, DA1469x, DA1470x, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, V850, 78K0R, 78K0]
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Programmer (Unit/SW) | Renesas |
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