Overview

µPD166027T1J is part of 2nd Generation Intelligent Power Devices (IPD). They are N-channel high-side switches with charge pump, voltage controlled input, diagnostic feedback with proportional load current sense and embedded protection function. Family includes up to 10 devices depending on on-state resistance, package and channel number combination. Scalability: Variety of on-state resistance combined with standardized package on pin-out give user high flexibility for unit design depending on target load. Robustness: Because of advanced protection method, 2nd Generation Intelligent Power Devices achieve high robustness against long term and repetitive short circuit condition.

  • Built-in charge pump
  • 3.3V compatible logic interface
  • Low standby current
  • Short circuit protection
    • Shutdown by over current detection
    • Power limitation protection by over load detection (Power limitation: current limitation with delta Tch control)
    • Absolute Tch over temperature protection
  • Built-in diagnostic function
    • Proportional load current sensing
    • Defined fault signal in case of abnormal load condition
  • Loss of ground protection
  • Under voltage lock out
  • Active clamp operation at inductive load switch off
  • AEC Qualified
  • RoHS compliant
  • Product Spec.
    • Nch/Pch: Nch
    • Automotive: YES
    • Package Type.: 12pinHSSOP
    • Type: High side
    • Channels: 2
    • RON (mohm) typ. @ Tj = 25 °C: 35
    • RON (mohm) max. @ Tj = 150 °C: 80
    • Vcc (V) min.: 4.5
    • Vcc (V) max.: 28
    • Vload dump (V): 42
    • IL (A) typ.: 2.5
    • IL (SC) (A): 22
    • Diagnostic: Current Sense
    • ton (µs) max.: 200
    • toff (µs) max.: 200
    • Tch (°C) min. :-40
    • Tch (°C): 150
    • Mounting: SMD
    • Production Status :Product Inquiry

Documentation

= Featured Documentation
Type Title Date
Datasheet
UPD166027T1J Data Sheet
PDF 829 KB 日本語
Application Note
IPD Product Group
PDF 729 KB
Brochure
Product Scout Automotive
PDF 9.16 MB
Product Change Notice
Unification of a JEDEC tray and a embossed carrier tape for LQFP package (Additional Information & Correction)
PDF 4.86 MB 日本語
Brochure
Power MOSFET & IPD
PDF 2.24 MB
Product Change Notice
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001B/E )
PDF 3.74 MB 日本語
Product Change Notice
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001A/E )
PDF 1.46 MB 日本語
Brochure
Renesas Semiconductor Lead-Free Packages
PDF 1.32 MB
8 items

Design & Development

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ECAD Models

Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.

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Product Options

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