Evaluation Kit for RA2A1 MCU Group
The EK-RA2A1 evaluation kit enables users to effortlessly evaluate the features of the RA2A1 MCU Group and develop embedded systems applications using Renesas' Flexible...
Overview
Description
download Download Latest FSP (v5.5.0):
FSP Platform Installer (Includes e² studio IDE, toolchain, and FSP packs):
RA Smart Configurator (RASC) Installer (FSP packages to use with 3rd party IDEs with IAR Embedded Workbench, Arm Keil MDK):
FSP Standalone Installer (FSP packs for the users who only update the FSP and no e² studio update):
- Download from the Assets section of the GitHub
The installation instructions can be found here. All the FSP Releases and Patches can be found on GitHub.
The Renesas Flexible Software Package (FSP) is an enhanced software package designed to deliver user-friendly, scalable, high-quality software for embedded system designs using the Renesas RA family of Arm Microcontrollers, ensuring software compatibility across the RA family, from entry-level to high-performance microcontrollers. With the support of new Arm® TrustZone® and other advanced security features, FSP provides a quick and versatile way to build secure, connected IoT devices using production-ready drivers, Azure® RTOS, FreeRTOS™, and other middleware stacks.
FSP includes best-in-class HAL drivers with high performance and low memory footprint. Middleware stacks with Azure RTOS and FreeRTOS integration are included to ease the implementation of complex modules like communication and security. The e² studio IDE provides support with intuitive configurators and intelligent code generation to make programming and debugging easier and faster.
FSP uses an open software ecosystem and provides flexibility in using bare-metal programming, including Azure RTOS or FreeRTOS, your preferred RTOS, legacy code, and third-party ecosystem solutions. FSP and e² studio can be used free of charge on any Renesas device.
Features
- Small memory footprint HAL drivers
- Intuitive configurator and code generator
- Static and dynamic analysis using industry-standard tools
- Application support using RTOS and non-RTOS environments
- Azure RTOS and its middleware stacks with Flexible Software Package
- Azure RTOS ThreadX, NetX Duo & Add-ons, USBX, GUIX & GUIX Studio, FileX, TraceX, exFAT, LevelX, NetX Duo Secure & NetX Crypto (HW acceleration)
- FreeRTOS support – Includes Kernel and set of software libraries
- FreeRTOS Kernel, FreeRTOS-Plus-TCP, Core MQTT, Core HTTP/HTTPS, Task pool, Secure Sockets, Cellular Interface
- Tool configurable RTOS resources (Threads, mutexes, etc.)
- Middleware stacks from Renesas and third parties.
- TCP/IP and other connectivity protocol stacks including MQTT
- USB middleware support for CDC, HID, and MSC
- Wireless connectivity through Cellular (Cat-M1), Wi-Fi, and Bluetooth Low Energy LE 5.0 (BLE Mesh)
- File System support with FreeRTOS+FAT and LittleFS
- Storage (Block Media) support for SDMMC, SPI, and USB.
- Virtual EEPROM on Flash
- Capacitive touch middleware to implement widgets like Button, Slider, and Wheels.
- Motor control algorithms
- Secure Bootloader through MCUboot
- Sensor Module APIs
- TrustZone support (for applications on CM33-based MCUs)
- TrustZone enabled drivers and middleware
- Easy-to-use tool support for TrustZone configuration
- PSA Level 2 Certified
- AWS qualified for FreeRTOS
- Easy connectivity options to major cloud providers
- Secure connections through NetX Duo Secure and Mbed TLS
- Cryptographic APIs and integrated Hardware Acceleration support
- Arm PSA Cryptographic APIs
- Azure RTOS NetX Crypto APIs
- Ultimate security with FSP Crypto APIs (SCE9 protected mode)
- TinyCrypt targeting constrained devices
- Graphics interface support and tools
- Segger emWin (RA customers can use Segger emWin graphic tools and libraries for free from Downloads below)
- Azure RTOS GUIX and GUIX Studio (available free on Microsoft Apps Store)
- Secure debugging capabilities
- Extensive tool support from Renesas and leading third-party solutions
- Integrated package with all required components for easy setup and starting development (single installer with e2 studio, CMSIS packs, toolchain, and Segger J-Link drivers)
- Complete source code available through GitHub
Release Information
For additional information and links go to GitHub.
v5.5.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.5.0.
Minimum e2 studio version for FSP 5.5.0 is e2 studio 2024-07
- Download the FSP with e2 studio Windows installer for this release: FSP Windows Platform Installer
- Download the FSP with e2 studio Linux AppImage for this release: FSP Linux Platform Installer
- Download the FSP with e2 studio MacOS (Apple Silicon) installer for this release: FSP MacOS Platform Installer
Refer to Installing e² studio in a Linux PC | Renesas Customer Hub for information on installing e2 studio and related software components on a Linux PC.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator (RASC) for this release,
- For Windows download: FSP RASC Windows Installer
- For Linux download: FSP RASC Linux Installer
- For macOS (Apple Silicon) download: FSP RASC macOS Installer
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
New Features
- Added support for the following boards:
- VK-RA8M1
- VOICE-RA2L1
- VOICE-RA4E1
- VOICE-RA6E1
- OSPI/DOTF: Added support for wrapped AES keys
- DA14531/DA14535: Added support for Legacy Pairing, Just Works, and Passkey pairing methods as well as initiating pairing from the Peripheral side
- Block Media RAM middleware now supports SDRAM and other memory-mapped RAM devices
- SCI UART driver now supports IrDA communication on supported devices
- Added support for lwIP (lightweight TCP/IP) stack
- Added support for ZMOD4510 NO2 O3 sensor
- Support Dual Bank mode for Flash LP with MCUboot
- Added LittleFS support for external Flash
- Added support for GM02S LTE module
- GM cellular modules are a direct replacement for RYZ. As such, certain EWF and AWS cellular interface usage notes will now reference GM instead of RYZ. Some support for RYZ nomenclature has been retained for compatibility purposes.
Fixes and Improvements
- MCUBoot updated to 2.1.0
- Arm Mbed TLS updated to 3.6.0
- FreeRTOS+TCP updated to 4.2.1
- Segger JLink version updated to 7.98b
- CMSIS-DSP updated to 1.16.2
- RA8x1 Updates to clocks tab
- Updated the tooltip for ICLK and PCLKs to match the description in the hardware manual
- RA8T1 Removed unsupported clocks from clock tree (LCDCLK, U60CK, OCTASPICLK)
- Added missing PLL divider option (PLL Div / 4)
- Additional code size optimizations for TML32 and SAU UART drivers on RA0E1
- Fixed AC6/LLVM warning in rm_motor_driver (Implicit conversion from float to uint16_t)
- Fixed issue in AC6 linker scripts where extra RAM was being allocated for non-secure buffers in NetX projects on devices that don't support TrustZone.
- RA2A2 Fixed issue where the LOCO could be selected as a clock source for RTC (Only Sub-Clock is available)
- RA0E1 Fixed issue where the weekday field was not being calculated in the r_rtc module.
- IICA Fixed build warning in generated code when SDLA and SDAA pins were disabled.
- IICA Fixed issue where transfers were not aborted after receiving a NACK
- Fixed build errors when 'Enable inline BSP IRQ functions' setting is enabled on CM4 devices
- Fixed write value of unused mask invalid bits in r_can driver (applies to FIFO mode only)
- Fixed unresolvable constraint when multiple I3C stacks are added
- Added warnings for certain invalid clock configurations on some devices
- Fixed invalid Developer Assistance callback entry for SAU UART
- CTSU: Fixed issue with capacitive touch filter
- Fixed issue with upgrade mode (Direct XIP) using MCUboot and internal code flash
- Fixed issue with CEU capture
- Fixed TRNG drawing excessive current after use when placed in power down
- DSI: Fixed virtual channel ID for HS sequence operations
- Common FSP API support updated to v1.7.0
- Update MQTT usage notes
- IAR EW projects now correctly select size-based optimization for RA0E1 projects by default
- SMBus now provides unique error codes for different timeout events via rm_comms_callback_args_t::p_instance_args
Deprecations
- FS2012 and OB1203 sensor modules
- RYZ cellular modules
- ZMOD4410
- ZMOD4510
Known Issues
- RA0E1:
- e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
- Add optimization flags (e.g. -O0) manually to 'Other optimization flags' to override the -Oz setting
- HS400x, ZMOD4xxx, and OB1203 sensors cannot be used on RA0E1
- FS1015 and FS3000 sensors do not support SAU-I2C driver
- e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
- Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when using a USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.
- PMSC may not work properly when USBX Composite Device (PCDC+PMSC) is connected to a specific Linux OS (USB Host).
Target Devices
Downloads
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Design & Development
Sample Code
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e² studio Tips - How to Import Example Project in e² studio for RA
This video shows how to import the Renesas RA Flat project and TrustZone project in e² studio.
e² studio Tips - How to Import Example Project in e² studio for RA
0:00:00 Opening
0:00:14 Flat Project and TrustZone Project
0:00:34 Set up IDE
0:00:54 Download Example Project
0:01:07 Import Flat Project
0:02:44 Import TrustZone Project
0:04:30 e² studio User Guide
Video List
Events & Webinars
News & Blog Posts
| Blog Post | Nov 15, 2022 | ||
| Blog Post | Apr 28, 2022 | ||
| Blog Post | Sep 25, 2021 | ||
| Blog Post | Jun 29, 2021 | ||
| News | Jun 15, 2021 |
Additional Details
Components
- CMSIS compliant pack files for e2 studio integrated development environment
- BSPs for RA MCUs and boards
- HAL drivers to access peripherals
- Real Time Operating Systems (RTOS)
- Middleware stacks and protocols
- Module configurators and code generators
- Source files to integrate with any development environment and third-party tools
Supported Toolchains
Software components in the FSP support following toolchains:
- e2 studio Integrated Development Environment, with toolchain supports of GCC Arm Embedded and LLVM Embedded Toolchain for Arm
- IAR Embedded Workbench
- Arm Keil MDK
Software Installation Instructions
Refer to the FSP GitHub page for installation and usage instructions: FSP GitHub Instructions
e2 studio Integrated Development Environment
The FSP provides a host of efficiency-enhancing tools for developing projects targeting the Renesas RA series of MCU devices. The e2 studio Integrated Development Environment provides a familiar development cockpit from which the key steps of project creation, module selection and configuration, code development, code generation, and debugging are all managed. FSP uses a Graphical User Interface (GUI) to simplify the selection, configuration, code generation and code development of high level modules and their associated Application Program Interfaces (APIs) to dramatically accelerate the development process.
e2 studio is equipped with set of options to configure various aspects of your application project. Some of these options include:
BSP configuration
Configure or change MCU and board-specific parameters from the initial project selection.
Clock Configuration
Configure the MCU clock settings for your project. The Clock Configuration presents a graphical view of the MCU's clock tree, allowing the various clock dividers and sources to be modified.
Pin Configuration
The Pin Configuration provides flexible configuration of the MCU's pins. This configures the electrical characteristics and functions of each port pin. As many pins are able to provide multiple functions, the pin configurator makes it easy to configure the pins on a peripheral basis. The Pin Configuration tool simplifies the configuration of large packages with highly multiplexed pins by highlighting errors and presenting the options for each pin or for each peripheral.
Module Configuration
The Module Configuration provides options to add FSP modules (HAL drivers, Middleware stacks and RTOS) for RTOS and non-RTOS based applications and configure various parameters of the modules. For each module selected, the Properties window provides access to the configuration parameters, interrupt priorities, pin selections etc.
Interrupt Configuration
Interrupt Configuration allows to add new user interrupts or events and set interrupt priorities. This will also allow the user to bypass a peripheral interrupt and have user-defined ISRs for the peripheral interrupts.
Components Configuration
The Components configuration enables the individual modules required by the application to be included or excluded. All modules that are necessary for the modules added to the application are included automatically. You can easily include or exclude additional modules by ticking the box next to the required component.
QE Tools
QE for Capacitive Touch is an assistance tool for applications which operate under the e2 studio. For the development of embedded systems that work with capacitive touch sensors, this tool simplifies the initial settings of the touch user interface and the tuning of the sensitivity, thus shortening developing times.
The QE for BLE is a dedicated tool for developing embedded software in systems which support the Bluetooth®low energy protocol stack. This solution toolkit runs in the e2 studio integrated development environment. The combination of the e2 studio and QE for BLE makes it easy to test the communications features of Bluetooth®low energy.
Other Tool Features
- Context-sensitive Autocomplete feature that provides intelligent options for completing a programming element
- Developer Assistance tool for selection of and drag and drop placement of API functions directly in application code
- Smart Manual that provides driver and device documentation in the form of tooltips right in the code
- Edit Hover feature to show detailed descriptions of code elements while editing
- Welcome Window with links to example projects, application notes and a variety of other self-help support resources
- Information Icon for each module is provided in the graphic configuration viewer that links to specific design resources for that module in the user manual.
Third Party Tool Support
In addition to the Renesas e2 studio IDE, FSP supports third party tools and IDEs as well. This support is provided through RA Smart configurators (RASC) application. The Renesas RA Smart Configurator is a desktop application that allows you to configure the software system (BSP, drivers, RTOS and middleware) for a Renesas RA microcontroller when using a 3rd-party IDE and toolchain. The RA Smart Configurator can currently be used with IAR Embedded Workbench, Keil MDK and the Arm compiler 6 toolchains.