Evaluation Kit for RA6M3 MCU Group
The EK-RA6M3 evaluation kit enables users to seamlessly evaluate the features of the RA6M3 MCU Group and develop embedded systems applications using the Flexible...
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Overview
Description
The EK-RA6M3G evaluation kit enables users to seamlessly evaluate the features of the RA6M3 MCU Group and develop embedded systems applications using Renesas' Flexible Software Package (FSP) and e2 studio IDE. You can utilize rich on-board features along with your choice of popular ecosystem add-ons to bring your big ideas to life.
The EK-RA6M3G kit consists of two boards: the EK-RA6M3 board featuring the RA6M3 MCU with on-chip graphics LCD controller and the graphics expansion board featuring a 4.3-inch TFT color LCD with capacitive touch overlay.
Getting Started
Running the Quick Start Example Project
- The EK-RA6M3G comes pre-programmed with Quick Start example project (Provided with the example projects bundle).
- Connect the graphics expansion board to the graphics expansion port (J1) on the EK-RA6M3 board.
- Power up the EK-RA6M3G board through the debug USB port (J10) using the micro USB device cable connected to a 5V power source. The white power LED will light up.
- The Quick Start example project will begin to execute showing graphics elements on the screen.
- Refer to the EK-RA6M3G – Quick Start Guide (PDF) to explore additional functionality of the Quick Start example project.
Developing Embedded Applications
- Start with one of the many other example projects (Provided in the example projects bundle) – Choose from many example projects to learn about different peripherals for the RA6M3 MCU Group. These example projects can serve as excellent starting points for you to develop your custom applications.
Building Custom Hardware
- Start by building a functional prototype - Utilize the EK-RA6M3 and graphics expansion boards with your choice of hundreds of popular ecosystem add-ons.
- Build custom hardware – Develop custom hardware by referring to the design and manufacturing information provided in the EK-RA6M3Gv1 - Design Package (ZIP | English, 日本語)
Features
- Special Feature Access
- Ethernet (RMII and PHY)
- USB High Speed host and device
- 32MB External QSPI Flash
- MCU Native Pin Access
- R7FA6M3AH3CFC MCU
- 120MHz, Arm Cortex®-M4 core
- 2MB Code Flash, 640kB SRAM
- 176 pins, LQFP package
- Native pin access through 4x 40-pin male headers
- MCU and USB current measurement points
- Ecosystem & System Control Access
- USB Full Speed host and device
- Multiple 5V input sources
- USB (Debug, Full Speed, High Speed)
- External power supply
- SEGGER J-LinkTM on-board programmer and debugger
- Debug modes
- Debug On-board (SWD) – via J-Link
- Debug Out (SWD) – via J-Link
- Debug In (ETM, SWD & JTAG) – via J-Link, Arm® Keil® ULINKTM, IAR I-jetTM, Renesas E2/E2 Lite, etc.
- User LEDs and buttons
- Three user LEDs (red, blue, green)
- Power LED (white) indicating availability of regulated power
- Debug LED (yellow) indicating the debug connection
- Two User buttons
- One Reset button
- Four most popular ecosystems expansions
- MikroElektronikaTM mikroBUS connector
- Two SeeedGrove® system (I2C) connectors
- Two Digilent PmodTM (SPI and UART) connectors
- ArduinoTM (Uno R3) connector
- MCU boot configuration jumper
- Graphics Expansion Board
- 4.3-inch TFT color LCD
- 480 x 272 resolution
- Capacitive touch overlay with controller
- Back light controller
- SeggerTM emWin Embedded GUI Library
- Enables the creation of stunning graphics
- Powerful and easy to use API
- Uses ANSI C/C++ development environment
- Kit Contents: EK-RA6M3 board, Graphics expansion board, Micro USB device cable (type-A male to micro-B male), Micro USB host cable (type-A male to micro-B male), Ethernet patch cable
Applications
Design & Development
Software & Tools
Software & Tools
| Software title
|
Software type
|
Company
|
|---|---|---|
| RA Flexible Software Package (FSP) FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers.
Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain, and Segger J-Link drivers required to use this software. No additional installations are required.
|
Software Package | Renesas |
| Renesas Flash Programmer (Programming GUI) Flash memory programming software [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, RISC-V MCU Renesas Synergy, DA1453x, DA1459x, DA1469x, DA1470x, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, V850, 78K0R, 78K0]
|
Programmer (Unit/SW) | Renesas |
| SEGGER™ J-Link™ Software and Documentation Package Software utilities, firmware updates, and supporting documentation for the J-Link on-board programmer and debugger on the RA MCU kits.
|
Software Package | SEGGER |
| QuickConnect Platform QuickConnect platform enables fast prototyping by providing compatible hardware and software building blocks.
|
Software and Hardware Development Tools | Renesas |
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Sample Code
Related Boards & Kits
Processing table
RTK7EKA6M3S01001BU Active Samples Available
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|
136.87 | Get Samples, |
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Videos & Training
EK-RA6M3 Kit for Renesas Advanced (RA) Microcontrollers
Kickstart IoT and embedded systems development using Renesas EK-RA6M3, Evaluation Kit for RA6M3 MCU Group. Familiarize yourself with the kit architecture, key features, quick start example project and many useful resources to begin innovating quickly.
Video List
News & Blog Posts
| Develop Faster Using Example Projects for RA MCU Innovation Kits for IoT | Blog Post | Dec 3, 2021 |
| Quickly Programming RA MCU Innovation Kits for IoT | Blog Post | Dec 3, 2021 |
| Accelerate Debugging Using RA MCU Innovation Kits for IoT Applications | Blog Post | Nov 15, 2021 |
| Beginning to Innovate Has Never Been Easier | Blog Post | Nov 11, 2021 |
Certifications
The EK-RA6M3G kit meets the following certifications/standards. Refer to the EK-RA6M3G kit’s user manual for the disclaimer, precautions and more details on the certifications.
EMC/EMI Standards
- FCC Notice (Class A) – Part 15
- Innovation, Science and Economic Development Canada ICES-003 Compliance: CAN ICES-3 (A)/NMB-3(A)
- CE Class A (EMC Directive 2004/108/EEC)
- Taiwan Chinese National Standard 13438, C6357 compliance, Class A limits
- Australia/New Zealand AS/NZS CISPR 32:2015, Class A
Material Selection, Waste, Recycling, and Disposal Standards
- EU RoHS
- China SJ/T 113642014, 10-year environmental protection use period
Safety Standards
- UL 94V-0