Evaluation Kit for ZSSC3122 and ZSSC3123
The ZSSC3122-3123KIT SSC Evaluation Kit contains the hardware needed for configuration, calibration and evaluation of the ZSSC3122 and ZSSC3123 capacitive sensor signal...
Overview
Description
The ZSSC3123 cLite™ is a CMOS integrated circuit for accurate capacitance-to-digital conversion and sensor-specific correction of capacitive sensor signals. Digital compensation of sensor offset, sensitivity and temperature drift is accomplished via an internal digital signal processor running a correction algorithm with calibration coefficients stored in a nonvolatile EEPROM. The ZSSC3123 is configurable for capacitive sensors with capacitances up to 260pF and a sensitivity of 125aF/LSB to 1pF/LSB depending on resolution, speed, and range settings. It is compatible with both single capacitive sensors (both terminals must be accessible) and differential capacitive sensors. Measured and corrected sensor values can be output as I2C, SPI, PDM, or alarms. The I2C interface can be used for a simple PC-controlled calibration procedure to program a set of calibration coefficients into an on-chip EEPROM. The calibrated ZSSC3123 and a specific sensor are mated digitally: fast, precise, and without the cost overhead of trimming by external devices or laser.
Features
- Maximum target input capacitance: 260pF
- Sampling rates as fast as 0.7ms @ 8-bit, 1.6ms @ 10-bit, 5.0ms @ 12-bit, 18.5ms @ 14-bit
- Digital compensation of sensor: piece-wise 1st and 2nd order sensor compensation or up to 3rd order single-region sensor compensation
- Digital compensation of 1st and 2nd order temperature gain and offset drift
- Internal temperature compensation reference (no external components)
- Programmable capacitance span and offset
- Layout customized for die-die bonding with sensor for low-cost, high-density chip-on-board assembly
- Accuracy as high as ±0.25% full-scale output @ -40°C to 125°C, 3V, 5V, Vsupply ±10% (see data sheet section 1.3 for restrictions)
Comparison
Applications
Documentation
= Featured Documentation
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| Type | Title | Date |
| Datasheet | PDF 1.43 MB | |
| Overview | PDF 2.92 MB 日本語 | |
| Technical Brief | PDF 1.13 MB | |
| Technical Brief | PDF 679 KB | |
| Guide | 7Z 1.21 MB | |
| Datasheet - Short-form | PDF 450 KB | |
| Manual - Development Tools | PDF 777 KB | |
| Application Note | PDF 455 KB | |
| Application Note | PDF 209 KB | |
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Design & Development
Software & Tools
Boards & Kits
Mass Calibration System of ZSSC3123
The ZSSC3123 Mass Calibration System provides the hardware needed for simultaneous configuration, calibration and evaluation of multiple ZSSC3123 Capacitive Sensor...
Models
ECAD Models
Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.
Processing table
Pkg. Type |
Lead Count (#) |
Temp. Range |
Carrier Type |
Moisture Sensitivity Level (MSL) |
Price (USD) | 1ku |
Buy / Sample |
|
|---|---|---|---|---|---|---|---|
| Part Number | |||||||
| WAFER | 0 | -40 to 125°C | Wafer | 1 | |||
| WAFER | 0 | -40 to 125°C | Wafer | 1 | |||
| TSSOP | 14 | -40 to 125°C | Reel | 1 | |||
| TSSOP | 14 | -40 to 125°C | Tube | 1 | 3.113 | Get Samples, | |
| WAFER | 0 | -40 to 85°C | Wafer | 1 | |||
| WAFER | 0 | -40 to 85°C | Wafer | 1 | |||
| TSSOP | 14 | -40 to 85°C | Reel | 1 | |||
| TSSOP | 14 | -40 to 85°C | Tube | 1 | 3.189 | Get Samples, | |
| WAFER | 0 | -40 to 125°C | Wafer | 1 | |||
| WAFER | 0 | -40 to 125°C | Wafer | 1 | |||
| TSSOP | 14 | -40 to 125°C | Reel | 1 | Get Samples, | ||
| TSSOP | 14 | -40 to 125°C | Tube | 1 | 3.939 | Get Samples, | |
| WAFER | 0 | -40 to 85°C | Wafer | 1 | |||
| WAFER | 0 | -40 to 85°C | Wafer | 1 | |||
| TSSOP | 14 | -40 to 85°C | Reel | 1 | Get Samples, | ||
| TSSOP | 14 | -40 to 85°C | Tube | 1 | 3.663 | Get Samples, |
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Videos & Training
IDT Sensor Signal Conditioner (SSC) Evaluation Kit Overview
A brief introduction and overview of IDT's (acquire by Renesas) sensor signal conditioner evaluation kits. Evaluation kits generally consist of three parts: a communication interface board, a device board, and a sensor simulator board - all connected together. A sophisticated software GUI accompanies the kit, enabling an engineer to learn how to use the part rapidly, do quick prototyping, and practice calibrations.
Presented by David Grice, applications engineer at IDT. For more information about IDT's sensor signal conditioner products, visit the Sensor Signal Conditioner page.
Video List