Evaluation Kit for RA6M5 MCU Group
The EK-RA6M5 evaluation kit enables users to effortlessly evaluate the features of the RA6M5 MCU Group and develop embedded systems applications using the Flexible...
The EK-RA6M3 evaluation kit enables users to seamlessly evaluate the features of the RA6M3 MCU Group and develop embedded systems applications using the Flexible Software Package (FSP) and e2studio IDE. Utilize rich on-board features along with your choice of popular ecosystem add-ons to bring your big ideas to life.
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RA Flexible Software Package (FSP) FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers.
Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain, and Segger J-Link drivers required to use this software. No additional installations are required.
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Software Package | Renesas |
Renesas Flash Programmer (Programming GUI) Flash memory programming software [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, RISC-V MCU Renesas Synergy, DA1453x, DA1459x, DA1469x, DA1470x, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, V850, 78K0R, 78K0]
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Programmer (Unit/SW) | Renesas |
SEGGER™ J-Link™ Software and Documentation Package Software utilities, firmware updates, and supporting documentation for the J-Link on-board programmer and debugger on the RA MCU kits.
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Software Package | SEGGER |
QuickConnect Platform QuickConnect platform enables fast prototyping by providing compatible hardware and software building blocks.
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Software and Hardware Development Tools | Renesas |
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The EK-RA6M5 evaluation kit enables users to effortlessly evaluate the features of the RA6M5 MCU Group and develop embedded systems applications using the Flexible...
The EK-RA6M4 evaluation kit enables users to effortlessly evaluate the features of the RA6M4 MCU Group and develop embedded systems applications using the Flexible...
The EK-RA6M2 evaluation kit enables users to effortlessly evaluate the features of the RA6M2 MCU Group and develop embedded systems applications using the Flexible...
The EK-RA6M1 evaluation kit enables users to effortlessly evaluate the features of the RA6M1 MCU Group and develop embedded systems applications using Renesas' Flexible...
The Avnet Silica HoriZone is a cloud-ready Renesas RA board with a multi-sensor Arduino Shield and a secure element. It allows you to explore Renesas RA...
Aspinity's AB2 AML100 Application Board is a fully integrated analog event detection front end for power-constrained always-on products. The onboard AML100 analog...
Kickstart IoT and embedded systems development using Renesas EK-RA6M3, Evaluation Kit for RA6M3 MCU Group. Familiarize yourself with the kit architecture, key features, quick start example project and many useful resources to begin innovating quickly.
Blog Post | Apr 5, 2022 | ||
Blog Post | Dec 3, 2021 | ||
Blog Post | Dec 3, 2021 | ||
Blog Post | Nov 15, 2021 | ||
Blog Post | Nov 11, 2021 |
The EK-RA6M3 meets the following certifications/standards. Refer to the EK-RA6M3 user manual for the disclaimer, precautions and more details on the certifications.