Evaluation Kit for RA2A1 MCU Group
The EK-RA2A1 evaluation kit enables users to effortlessly evaluate the features of the RA2A1 MCU Group and develop embedded systems applications using Renesas' Flexible...
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Overview
Description
The Renesas Flexible Software Package (FSP) is an enhanced software package designed to deliver user-friendly, scalable, high-quality software for embedded system designs using the Renesas RA family of Arm Microcontrollers, ensuring software compatibility across the RA family, from entry-level to high-performance microcontrollers. With the support of new Arm® TrustZone® and other advanced security features, FSP provides a quick and versatile way to build secure, connected IoT devices using production-ready drivers, Azure® RTOS, FreeRTOS™, and other middleware stacks.
download Download Latest FSP (v5.8.0):
FSP Platform Installer (Includes e² studio IDE, toolchain, and FSP packs):
RA Smart Configurator (RASC) Installer (FSP packages to use with 3rd party IDEs with IAR Embedded Workbench, Arm Keil MDK):
FSP Standalone Installer (FSP packs for the users who only update the FSP and no e² studio update):
- Download from the Assets section of the GitHub
The installation instructions can be found here. All the FSP Releases and Patches can be found on GitHub.
FSP includes best-in-class HAL drivers with high performance and low memory footprint. Middleware stacks with Azure RTOS and FreeRTOS integration are included to ease the implementation of complex modules like communication and security. The e² studio IDE provides support with intuitive configurators and intelligent code generation to make programming and debugging easier and faster.
FSP uses an open software ecosystem and provides flexibility in using bare-metal programming, including Azure RTOS or FreeRTOS, your preferred RTOS, legacy code, and third-party ecosystem solutions. FSP and e² studio can be used free of charge on any Renesas device.
Features
- Small memory footprint HAL drivers
- Intuitive configurator and code generator
- Static and dynamic analysis using industry-standard tools
- Application support using RTOS and non-RTOS environments
- Azure RTOS and its middleware stacks with Flexible Software Package
- Azure RTOS ThreadX, NetX Duo & Add-ons, USBX, GUIX & GUIX Studio, FileX, TraceX, exFAT, LevelX, NetX Duo Secure & NetX Crypto (HW acceleration)
- FreeRTOS support – Includes Kernel and set of software libraries
- FreeRTOS Kernel, FreeRTOS-Plus-TCP, Core MQTT, Core HTTP/HTTPS, Task pool, Secure Sockets, Cellular Interface
- Tool configurable RTOS resources (Threads, mutexes, etc.)
- Middleware stacks from Renesas and third parties.
- TCP/IP and other connectivity protocol stacks including MQTT
- USB middleware support for CDC, HID, and MSC
- Wireless connectivity through Cellular (Cat-M1), Wi-Fi, and Bluetooth Low Energy LE 5.0 (BLE Mesh)
- File System support with FreeRTOS+FAT and LittleFS
- Storage (Block Media) support for SDMMC, SPI, and USB.
- Virtual EEPROM on Flash
- Capacitive touch middleware to implement widgets like Button, Slider, and Wheels.
- Motor control algorithms
- Secure Bootloader through MCUboot
- Sensor Module APIs
- TrustZone support (for applications on CM33-based MCUs)
- TrustZone enabled drivers and middleware
- Easy-to-use tool support for TrustZone configuration
- PSA Level 2 Certified
- AWS qualified for FreeRTOS
- Easy connectivity options to major cloud providers
- Secure connections through NetX Duo Secure and Mbed TLS
- Cryptographic APIs and integrated Hardware Acceleration support
- Arm PSA Cryptographic APIs
- Azure RTOS NetX Crypto APIs
- Ultimate security with FSP Crypto APIs (SCE9 protected mode)
- TinyCrypt targeting constrained devices
- Graphics interface support and tools
- Segger emWin (RA customers can use Segger emWin graphic tools and libraries for free from Downloads below)
- Azure RTOS GUIX and GUIX Studio (available free on Microsoft Apps Store)
- Secure debugging capabilities
- Extensive tool support from Renesas and leading third-party solutions
- Integrated package with all required components for easy setup and starting development (single installer with e2 studio, CMSIS packs, toolchain, and Segger J-Link drivers)
- Complete source code available through GitHub
Release Information
For additional information and links go to GitHub.
v5.8.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.8.0
Minimum e2 studio version for FSP 5.8.0 is e2 studio 2025-01
- Download the FSP with e2 studio Windows installer for this release: FSP Windows Platform Installer
- Download the FSP with e2 studio Linux AppImage for this release: FSP Linux Platform Installer
- Download the FSP with e2 studio MacOS (Apple Silicon) installer for this release: FSP MacOS Platform Installer
Refer to Installing e² studio in a Linux PC | Renesas Customer Hub for information on installing e2 studio and related software components on a Linux PC.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator (RASC) for this release,
- For Windows download: FSP RASC Windows Installer
- For Linux download: FSP RASC Linux Installer
- For macOS (Apple Silicon) download: FSP RASC macOS Installer
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
New Features
- Added support for RA4L1 including the following development boards:
- EK-RA4L1
- RSSK-RA4L1
- Added new CTSU features Automatic Judgement and Multiple Electrode Connection (RA4L1 only)
- Added SAU LIN support
- Added support for USBX Host Audio (HAUD) class
- Added COMMS SPI Module
- Added support for MCUBoot dual bank swap without device reset
- Release CAVP certified module for RSIP Protected Mode driver
- Added support for AES-192, SHA-224, 512/224, 512/256, and HMAC-SHA 224 functionality to the RSIP Protected
- Mode on RA8M1, RA8D1, and RA8T1
- RSIP Compatibility Mode updates to support additional key types for Key Injection including:
- HMAC-SHA 224 for RA8M1/D1/T1
- HMAC-SHA 224, ECC brainpoolP256r1 (Private key only) and ECC secp256k1 (Private key only) for RA4L1
Fixes and Improvements
- Added constraint message when dependent modules are missing in rm_motor_current stack
- Added missing constraint message for reference voltage selection in r_adc_d
- Fixed issue with allowing invalid values for property 'number of transfer sectors' in r_usb_pmsc module
- Added constraint message when dependent modules are missing in r_usb_pvnd stack
- r_gpt
- Fixed build errors with valid Compare Match A/B value
- Added fix to avoid invalid values in properties
- Added fix to avoid invalid values in the properties of rm_motor_driver
- Added fix to avoid invalid values in the properties of rm_motor_120_degree
- Updated PSA Crypto to support plaintext ECC keygen for SCE9
- Updated UM to show the default value of 'Use low voltage mode' property
- Fixed issues with RA8E1 clocks tab
- Fixed unsupported voltage threshold options available in the properties of r_lvd for RA8E1
- Reference to 'r_canfdlite' added to CAN FD Usage Notes page
- Fixed potential race condition in CAN FD RXMB read operation
- Added constraint message when dependent modules are missing in rm_hs400x stack
- r_usb_hcdc_ecm
- Fixed issue where an Ether constraint message was displayed even when the Ether module was not added to the stack
- Updated constraint message for heap
- Fixed missing NetX crypto enumeration on RA4E1 and RA6E1
- Improved AES code size
- Improved constraint message for r_tau
- J-Link version updated to version 8.10l
- Platform installer updated to include e2 studio 2025-01
- Updates to FreeRTOS modules including the below (see Third Party Software section for versioning):
- FreeRTOS
- FreeRTOS Kernel
- FreeRTOS-Plus-TCP
- FreeRTOS-Cellular Interface
- coreJSON
- coreMQTT
- coreHTTP
- corePKCS11
- Improved the accuracy of CTSU2 correction calculation
- Fixed issue with Developer Assistance for rm_rrh47000
- SEGGER emWin updated to v6.48
- Fixed issue in CGC where PLL settings were being applied to PLL2
- E2 Emulator and E2 Emulator Lite version updated to 2.4.8
- AWS Cellular Interface on GM (rm_cellular_gm_aws):
- Updated constraint logic for certain properties to allow only integers
- Added constraints to check for dependent stacks
- SCI_B UART (r_sci_b_uart):
- Updated module constraint for CTS/RTS Section
- Fix to allow A4 and A5 pins to configure as both GPIO and USB in RA4E2 and RA6E2 36-pin devices
- Fixed an issue on rm_netxduo_wifi where once a socket connect fails it cannot be reconnected
- Fixed baud rate update issue with DA16XXX Wi-Fi module and improved Baremetal performance
- Remove setting of the unused FLWAITR register in r_flash_lp
- Fixed issue where LVD security attribution registers were not set correctly in TrustZone projects
- Fixed pingroup selection for IICA in RA0E1
- E2 Emulator and E2 Emulator Lite version updated to 2.4.8
- Fixed a build warning in the USBX Host port code
- Removed redundant BSP 'Error Log' configuration (superseded by logging option in 'Assert Failures' property)
- Added LVD1 detection level change stabilization delay per RA0E1 technical update
- CAN FD data rate limit increased to 8Mbps per various 01/2025 technical updates
- JLink version updated to 8.12c
Deprecations
- FS2012 and OB1203 sensor modules
- RYZ cellular modules
- ZMOD4410 Odor mode
- ZMOD4510 OAQ 1st Gen mode
Known Issues
- RA0E1:
- e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
- Add optimization flags (e.g. -O0) manually to 'Other optimization flags' to override the -Oz setting
- HS400x, ZMOD4xxx, and OB1203 sensors cannot be used on RA0E1
- FS1015 and FS3000 sensors do not support SAU-I2C driver
- e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
- Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when using the USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear
- PMSC may not work properly when the USBX Composite Device (PCDC+PMSC) is connected to a specific Linux OS (USB Host)
- EWARM support for RA4L1:
- EWARM version 9.60.3 does not contain support for RA4L1. To develop with IAR for this device, it is necessary to install support patch files (arm_Renesas_RA4L1_patch_20250117_1.zip) which can be downloaded by EWARM v9.60.3 users from the IAR MyPages system.
Target Devices
Downloads
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Design & Development
Sample Code
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e² studio Tips - How to Import Example Project in e² studio for RA
This video shows how to import the Renesas RA Flat project and TrustZone project in e² studio.
e² studio Tips - How to Import Example Project in e² studio for RA
0:00:00 Opening
0:00:14 Flat Project and TrustZone Project
0:00:34 Set up IDE
0:00:54 Download Example Project
0:01:07 Import Flat Project
0:02:44 Import TrustZone Project
0:04:30 e² studio User Guide
Video List
Events & Webinars
News & Blog Posts
| Three Reasons You'll Want to Use Our Flexible Software Package for Your IoT Designs | Blog Post | Nov 15, 2022 |
| Arm Cortex-M85 Is Here, Is Your IoT Design Ready? | Blog Post | Apr 28, 2022 |
| The RA MCU Family is Made to Help Solve Your Design Challenges | Blog Post | Jan 28, 2022 |
| Get Where You’re Going with the Official Renesas RA Family Guide | Blog Post | Jan 28, 2022 |
| Renesas Extends Support for Microsoft Azure RTOS Across 32-bit MCU Families with Simple Licensing for Secure Embedded IoT Development | News | Jun 15, 2021 |
Additional Details
Components
- CMSIS compliant pack files for e2 studio integrated development environment
- BSPs for RA MCUs and boards
- HAL drivers to access peripherals
- Real Time Operating Systems (RTOS)
- Middleware stacks and protocols
- Module configurators and code generators
- Source files to integrate with any development environment and third-party tools
Supported Toolchains
Software components in the FSP support following toolchains:
- e2 studio Integrated Development Environment, with toolchain supports of GCC Arm Embedded and LLVM Embedded Toolchain for Arm
- IAR Embedded Workbench
- Arm Keil MDK
Software Installation Instructions
Refer to the FSP GitHub page for installation and usage instructions: FSP GitHub Instructions
e2 studio Integrated Development Environment
The FSP provides a host of efficiency-enhancing tools for developing projects targeting the Renesas RA series of MCU devices. The e2 studio Integrated Development Environment provides a familiar development cockpit from which the key steps of project creation, module selection and configuration, code development, code generation, and debugging are all managed. FSP uses a Graphical User Interface (GUI) to simplify the selection, configuration, code generation and code development of high level modules and their associated Application Program Interfaces (APIs) to dramatically accelerate the development process.
e2 studio is equipped with set of options to configure various aspects of your application project. Some of these options include:
BSP configuration
Configure or change MCU and board-specific parameters from the initial project selection.
Clock Configuration
Configure the MCU clock settings for your project. The Clock Configuration presents a graphical view of the MCU's clock tree, allowing the various clock dividers and sources to be modified.
Pin Configuration
The Pin Configuration provides flexible configuration of the MCU's pins. This configures the electrical characteristics and functions of each port pin. As many pins are able to provide multiple functions, the pin configurator makes it easy to configure the pins on a peripheral basis. The Pin Configuration tool simplifies the configuration of large packages with highly multiplexed pins by highlighting errors and presenting the options for each pin or for each peripheral.
Module Configuration
The Module Configuration provides options to add FSP modules (HAL drivers, Middleware stacks and RTOS) for RTOS and non-RTOS based applications and configure various parameters of the modules. For each module selected, the Properties window provides access to the configuration parameters, interrupt priorities, pin selections etc.
Interrupt Configuration
Interrupt Configuration allows to add new user interrupts or events and set interrupt priorities. This will also allow the user to bypass a peripheral interrupt and have user-defined ISRs for the peripheral interrupts.
Components Configuration
The Components configuration enables the individual modules required by the application to be included or excluded. All modules that are necessary for the modules added to the application are included automatically. You can easily include or exclude additional modules by ticking the box next to the required component.
QE Tools
QE for Capacitive Touch is an assistance tool for applications which operate under the e2 studio. For the development of embedded systems that work with capacitive touch sensors, this tool simplifies the initial settings of the touch user interface and the tuning of the sensitivity, thus shortening developing times.
The QE for BLE is a dedicated tool for developing embedded software in systems which support the Bluetooth®low energy protocol stack. This solution toolkit runs in the e2 studio integrated development environment. The combination of the e2 studio and QE for BLE makes it easy to test the communications features of Bluetooth®low energy.
Other Tool Features
- Context-sensitive Autocomplete feature that provides intelligent options for completing a programming element
- Developer Assistance tool for selection of and drag and drop placement of API functions directly in application code
- Smart Manual that provides driver and device documentation in the form of tooltips right in the code
- Edit Hover feature to show detailed descriptions of code elements while editing
- Welcome Window with links to example projects, application notes and a variety of other self-help support resources
- Information Icon for each module is provided in the graphic configuration viewer that links to specific design resources for that module in the user manual.
Third Party Tool Support
In addition to the Renesas e2 studio IDE, FSP supports third party tools and IDEs as well. This support is provided through RA Smart configurators (RASC) application. The Renesas RA Smart Configurator is a desktop application that allows you to configure the software system (BSP, drivers, RTOS and middleware) for a Renesas RA microcontroller when using a 3rd-party IDE and toolchain. The RA Smart Configurator can currently be used with IAR Embedded Workbench, Keil MDK and the Arm compiler 6 toolchains.