| タイトル | 情報 |
|---|---|
| Pkg. Name Name used to describe Renesas packages.
|
D16.3 |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
H4G |
| Package Description Descriptive text for this package.
|
16 LD SBDIP, SOLDER SEAL |
| Package Status | Active |
| Package Type | SBDIP |
| クラス | HERMETIC |
| Package Code The unique identifier of this package.
|
H4G |
| カテゴリ | HERMETIC |
| Lead Count | 16 |
| Pb (Lead) Free | Yes |
| 長さ | 20.32mm |
| 幅 | 7.49mm |
| Thickness 取り付け高さ or 本体高さ
(外形図をご参照ください) |
2.41mm |
| Pitch | 2.54mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
20.32 x 7.49 x 2.41 |
H4G (SBDIP 16)
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