タイトル | 情報 |
---|---|
Pkg. Name Name used to describe Renesas packages.
|
MDP0027 |
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
MHE |
Package Description Descriptive text for this package.
|
20 LEAD SOIC (300MIL) (Pb-Free) |
Package Status | Active |
Package Type | SOICW |
クラス | PLASTIC |
Package Code The unique identifier of this package.
|
MHE |
カテゴリ | PLASTIC |
Lead Count | 20 |
Pb (Lead) Free | Yes |
長さ | 12.8mm |
幅 | 7.49mm |
Thickness 取り付け高さ or 本体高さ
(外形図をご参照ください) |
0mm |
Pitch | 0mm |
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
12.80 x 7.49 x 0.00 |