| タイトル | 情報 |
|---|---|
| Pkg. Name Name used to describe Renesas packages.
|
MDP0027 |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
MHK |
| Package Description Descriptive text for this package.
|
28 LEAD SOIC (300MIL) (Pb-Free) |
| Package Status | Active |
| Package Type | SOICW |
| クラス | PLASTIC |
| Package Code The unique identifier of this package.
|
MHK |
| カテゴリ | PLASTIC |
| Lead Count | 28 |
| Pb (Lead) Free | Yes |
| 長さ | 17.88mm |
| 幅 | 7.49mm |
| Thickness 取り付け高さ or 本体高さ
(外形図をご参照ください) |
0mm |
| Pitch | 0mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
17.88 x 7.49 x 0.00 |
MHK (SOICW 28)
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