| タイトル | 情報 |
|---|---|
| Pkg. Name Name used to describe Renesas packages.
|
M28.3 |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
MHU |
| Package Description Descriptive text for this package.
|
28 LEAD SOIC (300MIL) |
| Package Status | Active |
| Package Type | SOICW |
| クラス | PLASTIC |
| Package Code The unique identifier of this package.
|
MHU |
| カテゴリ | PLASTIC |
| Lead Count | 28 |
| Pb (Lead) Free | Yes |
| 長さ | 17.93mm |
| 幅 | 7.52mm |
| Thickness 取り付け高さ or 本体高さ
(外形図をご参照ください) |
0.2mm |
| Pitch | 1.27mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
17.93 x 7.52 x 0.20 |
MHU (SOICW 28)
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