タイトル | 情報 |
---|---|
Pkg. Name Name used to describe Renesas packages.
|
M14.15 |
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
MOR |
Package Description Descriptive text for this package.
|
SOIC 8.65x3.90x1.75 mm 1.27mm Pitch |
Package Status | Active |
Package Type | SOIC |
クラス | PLASTIC |
Package Code The unique identifier of this package.
|
MOR |
カテゴリ | G |
Lead Count | 14 |
Pb (Lead) Free | Yes |
長さ | 8.65mm |
Pb Free Category | e3 Sn |
幅 | 3.9mm |
Thickness 取り付け高さ or 本体高さ
(外形図をご参照ください) |
1.75mm |
Peak Reflow Temp | 260°C |
Pitch | 1.27mm |
Package Carrier | Reel, Tube |
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
8.65 x 3.9 x 1.75 |