| タイトル | 情報 |
|---|---|
| Pkg. Name Name used to describe Renesas packages.
|
M14.15 |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
MOR |
| Package Description Descriptive text for this package.
|
SOIC 8.65x3.90x1.75 mm 1.27mm Pitch |
| Package Status | Active |
| Package Type | SOIC |
| クラス | PLASTIC |
| Package Code The unique identifier of this package.
|
MOR |
| カテゴリ | G |
| Lead Count | 14 |
| Pb (Lead) Free | Yes |
| 長さ | 8.65mm |
| Pb Free Category | e3 Sn |
| 幅 | 3.9mm |
| Thickness 取り付け高さ or 本体高さ
(外形図をご参照ください) |
1.75mm |
| Peak Reflow Temp | 260°C |
| Pitch | 1.27mm |
| Package Carrier | Reel, Tube |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
8.65 x 3.9 x 1.75 |
MOR (SOIC 14)
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