タイトル | 情報 |
---|---|
Pkg. Name Name used to describe Renesas packages.
|
M28.3 |
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
MWM |
Package Description Descriptive text for this package.
|
28 LEAD SOIC (300MIL) Carsem (Pb-Free) |
Package Status | Active |
Package Type | SOICW |
クラス | PLASTIC |
Package Code The unique identifier of this package.
|
MWM |
カテゴリ | PLASTIC |
Lead Count | 20 |
Pb (Lead) Free | Yes |
長さ | 17.93mm |
幅 | 7.52mm |
Thickness 取り付け高さ or 本体高さ
(外形図をご参照ください) |
0.2mm |
Pitch | 1.27mm |
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
17.93 x 7.52 x 0.20 |