| タイトル | 情報 |
|---|---|
| Pkg. Name Name used to describe Renesas packages.
|
W8X8.64 |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
WDC |
| Package Description Descriptive text for this package.
|
8x8 Array 64 Balls, 0.5mm Pitch, Wafer Level Chip Scale (ASE), Chung-Li, Taiwan |
| Package Status | Active |
| Package Type | WLCSP-TCURDL |
| クラス | PLASTIC |
| Package Code The unique identifier of this package.
|
WDC |
| カテゴリ | PLASTIC |
| Lead Count | 64 |
| Pb (Lead) Free | Yes |
| 長さ | 4.03mm |
| 幅 | 4.03mm |
| Thickness 取り付け高さ or 本体高さ
(外形図をご参照ください) |
0.6mm |
| Pitch | 0.5mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
4.03 x 4.03 x 0.60 |
WDC (WLCSP-TCURDL 64)
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